Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Satoshi Okude"'
Autor:
Kumi Onodera, Masahiro Okamoto, Nobuki Ueta, Koji Munakata, Osamu Nakao, Satoshi Okude, Kazu Itoi, Theodore G. Tessier
Publikováno v:
International Symposium on Microelectronics. 2014:000161-000164
As electronic devices decrease in size and increase in functionality, their surface-mount components grow in number. This trend created a need for securing appropriate space in and on a wiring board to accommodate necessary components. Conventionally
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7592923b39e1d57cd73545a0ff4172d3
https://doi.org/10.4071/isom-ta62
https://doi.org/10.4071/isom-ta62
Autor:
David Clark, Yoshinori Sano, Theodore G. Tessier, Osamu Nakao, Senthil Sivaswamy, Tony Curtis, Kazuhisa Itoi, Nobuyuki Ueta, Satoshi Okude, Masahiro Okamoto
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:1-32
Fan-Out Wafer Level Packaging (FO-WLP) technology has been developed in recent years to overcome the limitations of Fan-in WLP (FI-WLP) packages and to add more functionality to WLP. Fan-Out packages expand the WLP market to higher pin count devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ca0abf6e0611c4faa8ba8044292822b
https://doi.org/10.4071/2012dpc-wa24
https://doi.org/10.4071/2012dpc-wa24
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001253-001283
We have developed active and passive devices embedded multilayer board utilizing our laminate-based WLCSP embedding technology. The proposed embedded board is realized by laminating plural circuit formed polyimide films together by adhesive with thin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab9e1cdfad447da67510e76df8c9c4ab
https://doi.org/10.4071/2012dpc-tp44
https://doi.org/10.4071/2012dpc-tp44
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001071-001104
We have developed an ultrathin IC-embedded polyimide multi-layer wiring board utilizing a wafer level packaging (WLP) technology. The IC die is wafer level packaged with no solder bump (i.e. just copper land), thinned less than 100 micron and then sa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66c1a2e60f91262cafe4f71bfb0c0d7e
https://doi.org/10.4071/2011dpc-tp34
https://doi.org/10.4071/2011dpc-tp34
Autor:
Kouichi Awazu, Yoshimichi Ohki, Masahiro Suzuki, Seung Jun Yu, Makoto Fujimaki, Eisuke Yamaguchi, Satoshi Okude
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 265:490-494
Birefringence can be induced in silica-based optical fibers by ion implantation. In the present research, protons were implanted in single-mode optical fibers with two different energies, one being the energy with which the protons can just reach the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5f124f8cc4a14217f95acfb007e5efc
https://doi.org/10.1016/j.nimb.2007.09.044
https://doi.org/10.1016/j.nimb.2007.09.044
Publikováno v:
Electronics and Communications in Japan (Part I: Communications). 79:12-19
The nonlinear refractive index coefficient n2 dependence on the GeO2 concentration in optical fibers is quantitatively shown for SiO2 core fibers and GeO2-SiO2 core/SiO2 clad fibers with Δ = 0.35–2.2% using an XPM measurement method where the phas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47b000fb51ba4256f099bd90d23365ba
https://doi.org/10.1002/ecja.4410791102
https://doi.org/10.1002/ecja.4410791102
Publikováno v:
Optical Fiber Sensors.
An inexpensive and high-accuracy optical sensing method utilizing an angled three-fiber-array is proposed and demonstrated. By combination of the temperature and pressure sensors, we achieved a temperature compensated pressure sensor with accuracy of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c4ba8ed5bdd97194a0a053a96c78784
https://doi.org/10.1364/ofs.2006.tue28
https://doi.org/10.1364/ofs.2006.tue28
Publikováno v:
SPIE Proceedings.
An optical pressure sensor utilizing a silica-based GRIN rod lens is proposed and demonstrated. The major advantage of the sensor is inexpensive system configuration whose main part consists of low-cost components such as the rod lens, an LED light-s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aac2889072964e1088375e772566a155
https://doi.org/10.1117/12.623609
https://doi.org/10.1117/12.623609
Publikováno v:
Extended Abstracts of the 2005 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::642073ab29bd6959c299a1f3dc04da9a
https://doi.org/10.7567/ssdm.2005.d-1-5
https://doi.org/10.7567/ssdm.2005.d-1-5
Publikováno v:
Journal of Lightwave Technology.
Tunable second order dispersion compensator is realized utilizing linear chirped FBG with double ring structure. Tunable range from -100 to 100 ps/nm/sup 2/ is achieved in keeping center wavelength and first order dispersion constant.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ddbfef638869a78d6a27e251e5a8f184
https://doi.org/10.1109/ofc.2003.1247472
https://doi.org/10.1109/ofc.2003.1247472