Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Satish Parupalli"'
Autor:
Dr. Satish Parupalli, Dr. D Mithun
Publikováno v:
International Journal of Orthopaedics Sciences. 5:87-93
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce3193f9c4be1746724dccb181150298
https://doi.org/10.22271/ortho.2019.v5.i4b.2913
https://doi.org/10.22271/ortho.2019.v5.i4b.2913
Publikováno v:
National Journal of Clinical Orthopaedics. 2:205-211
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::498c2e8262417c9b8a8b4ca97724ca8e
https://doi.org/10.33545/orthor.2018.v2.i4c.324
https://doi.org/10.33545/orthor.2018.v2.i4c.324
Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bfc9d5842152a69dff95d767963e05a
https://doi.org/10.1109/ectc.2018.00222
https://doi.org/10.1109/ectc.2018.00222
Autor:
Satish Parupalli, Balu Pathangey, Karumbu Meyyappan, Anil Kurella, Gregorio R. Murtagian, Alan McAllister
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 14:869-877
Long-term reliability of electrical connectors are influenced by the type of plating and plating process. In this paper, the authors look for a viable alternative to 400-nm ENIG + EG (electroless Ni, immersion Au + electroless Au) for microelectronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d8b9380fb54c96f0c7c4291db556501
https://doi.org/10.1109/tdmr.2014.2333758
https://doi.org/10.1109/tdmr.2014.2333758
Publikováno v:
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B.
The continual drive toward smaller second level interconnect dimensions, along with the introduction of Halogen-Free circuit board materials and increased process temperatures of Lead-Free solders, have all contributed to a more frequent occurrence o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fca24228d74adb898b84285d29bb46a
https://doi.org/10.1115/imece2012-85562
https://doi.org/10.1115/imece2012-85562
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
As customers embrace new mobile market segments, electronic systems containing direct ball grid array (BGA) components will inevitably experience greater stresses resting from shock and drop events during their use. These events can result in BGA fie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f174872b99d8b184a3f80b22ccb6a9e
https://doi.org/10.1109/ectc.2012.6248955
https://doi.org/10.1109/ectc.2012.6248955
Publikováno v:
International Symposium for Testing and Failure Analysis.
Some standard characterization techniques (solder ball pull, solder ball shear, etc.) exist for the assessment of solder ball mechanical fracture strength; however, it is not clear if these test methods would also provide characterization of printed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::961f833ef5e28a453b3e5dc0ea2dd631
https://doi.org/10.31399/asm.cp.istfa2008p0043
https://doi.org/10.31399/asm.cp.istfa2008p0043
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
With the technology trend moving towards faster, smaller, and cheaper products, the consumer electronics industry is using more and more high density fine pitch BGA components in a lead-free environment. This has created additional board-level solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4749b7c208cb14d5f55ac138f89428dd
https://doi.org/10.1109/ectc.2007.374039
https://doi.org/10.1109/ectc.2007.374039