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pro vyhledávání: '"Sathya Tiagaraj"'
Autor:
Gerald S. Pasdast, Sathya Tiagaraj, Elsherbini Adel A, Swan Johanna M, Kimin Jun, Shawna M. Liff
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Die stacking enables significant performance leaps in computing capability and memory/processor integration. Conventional die stacking uses solder interconnects which suffer from several scaling limitations. A new die to die interconnect technology,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff0bb0358f314e870764363ce01acfe
https://doi.org/10.1109/ectc32696.2021.00166
https://doi.org/10.1109/ectc32696.2021.00166
