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pro vyhledávání: '"Sareddy Kr"'
Autor:
Li Jao, Ming Hung Lai, Sareddy Kr, Meng Hung Tsai, Angelo Espina, Min Hua Chung, Chong Leong Gan
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55e8d27b5c7c46cbdc9adceaba5e45e0
https://doi.org/10.1109/eptc56328.2022.10013292
https://doi.org/10.1109/eptc56328.2022.10013292
