Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Saravuth Sirinorakul"'
Autor:
T. Jun Dimaano Panumard, Saravuth Sirinorakul, Kyaw Ko Lwin, Carolyn Epino Tubillo, Nathapong Suthiwongsunthorn
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Copper clip package plays a critical role in meeting the increasing requirement for lower total device resistance RDS(on), higher power density and high frequency switching applications. The copper clips replaced traditional wirebond interconnect for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::851377d97332b70c2399655687a5a172
https://doi.org/10.1109/eptc.2016.7861457
https://doi.org/10.1109/eptc.2016.7861457
Autor:
Kyaw Ko Lwin, Carolyn Epino Tubillo, Ang Choon Ghee Jim Dimaano, Saravuth Sirinorakul, Daniel Ting Lee Teh, Gu Bin, Nathapong Suthiwongsunthorn
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The increasing demand and requirements for package with smaller footprint, higher dense I/O counts and better performance at lower cost are one of the key challenges faced by semiconductor manufacturing companies. As one of the strategies for sustain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1be9edecdb570bb23fe5617cd1da23ef
https://doi.org/10.1109/eptc.2014.7028389
https://doi.org/10.1109/eptc.2014.7028389
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.