Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Sara, Hunegnaw"'
Autor:
Zhen Qi, Monika M. Biener, Ajay R. Kashi, Sara Hunegnaw, Alvin Leung, Sichao Ma, Ziyang Huo, Kendra P. Kuhl, Juergen Biener
Publikováno v:
Materials Research Letters, Vol 9, Iss 2, Pp 99-104 (2021)
We report on integrating ultrathin monolithic nanoporous gold (npAu) catalyst coatings for CO2 reduction in a large electrode area (25 cm2) electrochemical membrane reactor with gas diffusion electrodes at 100 mA/cm2. The CO Faraday efficiency increa
Externí odkaz:
https://doaj.org/article/0859ff098abc47cc8f836bab6c27da58
Autor:
Emily Jeng, Zhen Qi, Ajay R. Kashi, Sara Hunegnaw, Ziyang Huo, John S. Miller, Leonardus B. Bayu Aji, Byung Hee Ko, Haeun Shin, Sichao Ma, Kendra P. Kuhl, Feng Jiao, Juergen Biener
Publikováno v:
ACS Applied Materials & Interfaces. 14:7731-7740
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6c7f6c2fb517bf6046456caaaf66299
https://doi.org/10.1021/acsami.1c17860
https://doi.org/10.1021/acsami.1c17860
Autor:
Jun Wang, Hobie Yun, Tobias Bernhard, Zhiming Liu, Hailuo Fu, Aric Shorey, Sara Hunegnaw, Michael Merschky, Tafadzwa Magaya
Publikováno v:
International Symposium on Microelectronics. 2015:000365-000369
Inorganic interposers made of glass are attractive for advanced high frequency applications and ultra- fine line patterning technology. Because glass combines a couple of benefits like large form factor, good coefficient of thermal expansion (CTE) ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3cec7ff62bf4bc97768435f28417c55
https://doi.org/10.4071/isom-2015-wp21
https://doi.org/10.4071/isom-2015-wp21
Publikováno v:
International Symposium on Microelectronics. 2014:000393-000396
In this study a thin-film adhesive metal oxide layer is described that forms chemical bonds with glass, and mechanically anchors to copper to create strong, reliable adhesion between the glass substrate and the deposited metal. A modified sol-gel dep
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a65740d244eb1e2e5f2583a454f1e2d
https://doi.org/10.4071/isom-wa14
https://doi.org/10.4071/isom-wa14
Autor:
Lutz Brandt, Tobias Bernhard, Simon Bamberg, Michael Merschy, Hailuo Fu, Frank Bruening, Zhiming Liu, Sara Hunegnaw, Robin Taylor
Publikováno v:
International Symposium on Microelectronics. 2013:000635-000640
Ultra-miniaturization and 3D integration of electronic systems require interposers with a very high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. Through hole via formation or Thro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a58332da0d618879c319854e8734203
https://doi.org/10.4071/isom-2013-wp15
https://doi.org/10.4071/isom-2013-wp15
Autor:
Sara Hunegnaw, Tafadzwa Magaya, Michael Merschky, Satoru Kuramochi, Jun Wang, Akira Mieno, Aric Shorey, Zhiming Liu, Miyuki Akazawa, Hailuo Fu, Hobie Yun
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High performance radio frequency (RF) front end filters were fabricated using glass interposer and 3D packaging technologies, especially through glass vias (TGV) and direct Cu metallization on the glass. Major challenges for the use of TGV in RF and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8547d4272c0a68cd4af3c3ab40fd7ef6
https://doi.org/10.1109/ectc.2016.230
https://doi.org/10.1109/ectc.2016.230
Autor:
Jun Wang, Kenichiroh Mukai, Tafadzwa Magaya, Zhiming Liu, Sara Hunegnaw, Michael Merschky, Hailuo Fu
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper a glass-copper interface adhesion promoting thin film is described that forms chemical bonds with glass, and mechanically and possibly chemically anchors to copper to create strong, reliable adhesion between the glass substrate and the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::838e7df51a04436f84949a3aa8bd6fd1
https://doi.org/10.1109/impact.2015.7365256
https://doi.org/10.1109/impact.2015.7365256
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
An economical and reliable copper metallization of dimensionally stable, non-conductive substrates, such as glass and ceramic, is becoming a major focus in electronic packaging technologies. Conventionally, adhesion on these substrates is achieved ei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a955e303234dcfcc3d3fd7f59ff3e68
https://doi.org/10.1109/impact.2014.7048460
https://doi.org/10.1109/impact.2014.7048460
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
This study showcases that metal oxide adhesion promoters (MOAP) can function as strong adhesive layers between plated Cu and glass/ceramic. In this new approach a 10-200 nm thick metal oxide layer is deposited by a modified sol gel process followed b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f782bbecda33f31b9a7b676d253e5f87
https://doi.org/10.1109/ectc.2014.6897517
https://doi.org/10.1109/ectc.2014.6897517