Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Santosh Joteppa"'
Publikováno v:
Egyptian Journal of Remote Sensing and Space Sciences, Vol 26, Iss 3, Pp 815- (2023)
Externí odkaz:
https://doaj.org/article/a14fa540a933444c9a861a7fda693e63
Publikováno v:
Egyptian Journal of Remote Sensing and Space Sciences, Vol 26, Iss 1, Pp 43-61 (2023)
Transmit Receive (TR) modules are the hardcore of the radar payload, which has day-night and all weather imaging capability in earth observation satellites having military and civil applications. The TR modules in satellite application will experienc
Externí odkaz:
https://doaj.org/article/ca6d9150fdb24d888a1cf538d573ce8e
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811974731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1645e9931a033d50eaaf9342c276d606
https://doi.org/10.1007/978-981-19-7474-8_4
https://doi.org/10.1007/978-981-19-7474-8_4
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811974731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4c1923165ada65ef4601d78819d2a87
https://doi.org/10.1007/978-981-19-7474-8_21
https://doi.org/10.1007/978-981-19-7474-8_21
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811974731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d949cbc85c4eab51b456cc049b6ebf06
https://doi.org/10.1007/978-981-19-7474-8_16
https://doi.org/10.1007/978-981-19-7474-8_16
Structural and thermal modeling, verification, and optimization of space TR module for radar imaging
Autor:
Vinod S. Chippalkatti, Rajashekhar C. Biradar, B. K. Chandrashekar, K. R. Suresha, Santosh Joteppa
Publikováno v:
International Journal on Interactive Design and Manufacturing (IJIDeM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::602591051b8d5e9ccca2891440981c52
https://doi.org/10.1007/s12008-022-01133-3
https://doi.org/10.1007/s12008-022-01133-3
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75f5fb4dea2455bb61e7be560f879e27
https://doi.org/10.1109/eptc53413.2021.9663924
https://doi.org/10.1109/eptc53413.2021.9663924
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06491e4d36b1fc381b85dd262d4ada11
https://doi.org/10.1109/eptc53413.2021.9663973
https://doi.org/10.1109/eptc53413.2021.9663973
Publikováno v:
SEVENTH INTERNATIONAL SYMPOSIUM ON NEGATIVE IONS, BEAMS AND SOURCES (NIBS 2020).
Printed Circuit Boards (PCB) are most important parts of nearly all modern electronic devices meant for mechanical support to the electronic components and to create the conductive paths to meet the desired circuit or to electrically connect the elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80aa1090e499c9dff5a40b35fc410452
https://doi.org/10.1063/5.0057926
https://doi.org/10.1063/5.0057926
Autor:
Vinod Chippalkatti, Parvathy Rajendran, Santosh Joteppa, Shashank Dibbi, M. Uma Ravindra, B. K. Sharath
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811517235
Power supply module is designed to provide input power to digital system and radio frequency system for space application. High power and package density in electronics are continuously increasing, which create more heat in the system. Thermal manage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::234bb3e883f025543783f6c348406c3b
https://doi.org/10.1007/978-981-15-1724-2_46
https://doi.org/10.1007/978-981-15-1724-2_46