Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Sanka Ganesan"'
Publikováno v:
Microelectronics Reliability. 49:523-529
Wire-bonded chip-on-board (CoB) multi chip modules consist of die and bond wires that are encapsulated to protect them from mechanical and chemical damage. This paper describes a rapid-assessment model for the prediction of thermomechanical strains d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36ba65ed062fe3d058ffd12a9748d58c
https://doi.org/10.1016/j.microrel.2009.02.008
https://doi.org/10.1016/j.microrel.2009.02.008
Publikováno v:
Microelectronics Reliability. 48:663-674
This paper reviews the possible causes and effects for no-fault-found observations and intermittent failures in electronic products and summarizes them into cause and effect diagrams. Several types of intermittent hardware failures of electronic asse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e5c79ae55f762b84d5597ccc62df19c
https://doi.org/10.1016/j.microrel.2008.02.003
https://doi.org/10.1016/j.microrel.2008.02.003
Publikováno v:
Microelectronics Reliability. 47:1246-1250
An analytical model based on elastic strain energy minimization is developed for estimating the wire profile in unencapsulated ball-wedge wire bond configuration for chip-on-board (CoB) technology. The wire profile is applicable to ball-wedge bonds w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4188ac0cf557b8ea3934668c0173dec
https://doi.org/10.1016/j.microrel.2006.08.019
https://doi.org/10.1016/j.microrel.2006.08.019
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 30:128-137
Tin whiskering is a concern with tin-rich alloy finishes on electronic part terminations. Solder dipping may be used to replace the original finish with eutectic tin-lead solder for tin-whiskering risk mitigation purposes. However, the solder dipping
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5bdb59e950e9cba7b5df0fad9bdad19
https://doi.org/10.1109/tepm.2007.899127
https://doi.org/10.1109/tepm.2007.899127
Publikováno v:
Microelectronics Reliability. 46:360-366
Commercial-grade plastic encapsulated semiconductor devices are now widely used in space and military equipment for their cost-per-performance and availability advantages over military type ceramic parts. However, many equipment manufacturers still p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb480a3ce6d7a9241b8155e3339900a8
https://doi.org/10.1016/j.microrel.2004.12.019
https://doi.org/10.1016/j.microrel.2004.12.019
Publikováno v:
Microelectronics Reliability. 46:326-334
Outdoor telecommunications equipment can be exposed to ambient temperatures as low as −55 °C. However, microwave devices used in telecommunications infrastructure equipment are generally not rated to such low temperature. This paper assesses scatt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75e498d6cda98b541bdf25e99822df2c
https://doi.org/10.1016/j.microrel.2005.07.002
https://doi.org/10.1016/j.microrel.2005.07.002
Publikováno v:
Microelectronics Reliability. 46:400-408
When both precious metal electrode and base metal electrode (BME) capacitors were subjected to autoclave (121 °C/100% RH) testing for 500 h, it was found that the precious metal capacitors aged according to a well known aging mechanism (average capa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6957e9dc26a359d21eeb38499633a1ce
https://doi.org/10.1016/j.microrel.2005.05.008
https://doi.org/10.1016/j.microrel.2005.05.008
Autor:
Michael Pecht, Sanka Ganesan
Publikováno v:
Circuit World. 32:3-7
PurposeTo present and discuss open trace defects uncovered in an FR4 assembly during electrical testing.Design/methodology/approachThis paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b98948277f130262ab5e00adeb2564fc
https://doi.org/10.1108/03056120610616490
https://doi.org/10.1108/03056120610616490
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:884-894
An expedient transition to lead-free electronics has become necessary for most electronics industry sectors, considering the European directives [The Waste of Electrical and Electronic Equipment (WEEE) directive requires manufacturers to reduce the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::187f03e6d503ed4adefa4b9ae1ae4d9d
https://doi.org/10.1109/tcapt.2005.859353
https://doi.org/10.1109/tcapt.2005.859353
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 27:427-431
Whiskers are elongated single crystals of pure tin that have been reported to grow to more than 10 mm (250 mils) in length (though they are more typically 1 mm or less) and from 0.3 to 10 /spl mu/m. in diameter typical 1-3 /spl mu/m). Whiskers grow s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1eb8b695e9e6fa25aa5563f52170a81
https://doi.org/10.1109/tcapt.2004.831955
https://doi.org/10.1109/tcapt.2004.831955