Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Sanjoy K. Saha"'
Publikováno v:
IET Computer Vision, Vol 15, Iss 1, Pp 1-11 (2021)
Abstract The task of natural image segmentation is one of the most researched topics of computer vision. There are mainly two principal approaches for the task, the statistical approach and the supervised approach. The proposed methodology segments n
Externí odkaz:
https://doaj.org/article/c2f0b41648f4431591c7bb58d26c24de
Publikováno v:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Continuously increasing demand for higher compute performance is pushing for improved advanced thermal solutions. In high performance computing (HPC) area, most of the end users deploy some sort of direct or indirect liquid cooling thermal solutions.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc406d203128f2cc65daefceff9273e1
https://doi.org/10.1115/ipack2017-74055
https://doi.org/10.1115/ipack2017-74055
Autor:
Kothari Shrenik, Susan F. Smith, Ashish Gupta, Jha Chandra M, Sanjoy K. Saha, Bicen Baris, Hemanth K. Dhavaleswarapu
Publikováno v:
Volume 1: Thermal Management.
Multi-chip packages (MCPs) based solutions are becoming increasingly adopted as it results in higher signal count, density and enables increasing bandwidth demands and allows for heterogeneous integration [1,2]. However, manufacturing tolerances impo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0099856678a7cf268296ced453b2820
https://doi.org/10.1115/ipack2015-48362
https://doi.org/10.1115/ipack2015-48362
Autor:
Brett A. Cruden, Jianhua Zhou, Li Shi, Alan M. Cassell, Choongho Yu, Sanjoy K. Saha, Jun Li, Quoc Ngo
Publikováno v:
Journal of Heat Transfer. 128:234-239
It has been suggested that CNTs and carbon nanofibers CNFs can be used as thermal interface materials to enhance contact thermal conductance for electronic packaging applications. Several groups have reported mixed experimental results from no improv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7185322f59c0be5a39a5134312b7332
https://doi.org/10.1115/1.2150833
https://doi.org/10.1115/1.2150833
Autor:
Ronald Calhoun, Anil K. Vuppu, Patrick E. Phelan, Sanjoy K. Saha, Karl S. Booksh, Antonio A. Garcia, Mark A. Hayes
Publikováno v:
Journal of Applied Physics. 96:6831-6838
Paramagnetic particle suspensions placed in a rotating unidirectional magnetic field form magnetic chains that rotate with the same frequency as the field. The motion of the fluid and particles surrounding the chain differs in phase and frequency fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2995f5b3f2e8f03d1b0e7d2b3183b74
https://doi.org/10.1063/1.1809269
https://doi.org/10.1063/1.1809269
Publikováno v:
Journal of Applied Physics. 95:6492-6494
A nanofluid is a fluid containing suspended solid particles, with sizes on the order of nanometers. Normally, nanofluids have higher thermal conductivities than their base fluids. Therefore, it is of interest to predict the effective thermal conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9f351668c43a8586b5526dc196a8930
https://doi.org/10.1063/1.1736319
https://doi.org/10.1063/1.1736319
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The objective of thermal design requirement for 3D stacked die package is to maintain the junction temperatures of active devices in the package at or below specified limits. In this paper, die-to-die thermal resistance is identified as the key bottl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ef32870823846b2dbddc50bf5b46af0
https://doi.org/10.1109/impact.2012.6420312
https://doi.org/10.1109/impact.2012.6420312
Publikováno v:
2006 25th International Conference on Thermoelectrics.
Theoretical studies have suggested that Bi-based and III-V nanowire structures may have high thermoelectric figure of merit (ZT). It was found in a previous measurement that the thermoelectric properties of individual electro-deposited bismuth tellur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::043eb684b70dc967d54209ca11923ac8
https://doi.org/10.1109/ict.2006.331358
https://doi.org/10.1109/ict.2006.331358
Publikováno v:
Heat Transfer, Volume 1.
Surface roughness can play a large role in phonon transport in nanoscale devices. Phonon scattering at a surface is often treated to be either specular, diffusive, or partially specular and partially diffuse. The observation of backscattering of gas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::814ea13a039181ded3d76105b9a8036a
https://doi.org/10.1115/imece2006-15668
https://doi.org/10.1115/imece2006-15668
Autor:
Li Shi, Sanjoy K. Saha
Publikováno v:
Heat Transfer: Volume 1.
A Non Equilibrium Molecular Dynamics (NEMD) simulation has been used to calculate the temperature distribution in the substrate side of a nanometer scale point contact on a planar silicon substrate with different doping concentrations and contact rad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45347f5e7710735c28b4bcdeef94dd55
https://doi.org/10.1115/ht2005-72308
https://doi.org/10.1115/ht2005-72308