Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sanjay Shrirang Mane"'
Autor:
Marco Erstling, Elammaran Jayamani, Kok Heng Soon, Lars Bergmann, Sanjay Shrirang Mane, Jagdish C. Patra
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1258-1266
Recently, the circuit under pad (CUP) designs are getting very popular because they could save lots of silicon especially for high-density and high-complexity applications. Polysilicon is a material widely used in many electronic device components. W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14f6fcae28bd3205b2c11d8e67d4aff4
https://doi.org/10.1109/tcpmt.2021.3100100
https://doi.org/10.1109/tcpmt.2021.3100100
Autor:
Peter Dimitrovici, Angela Fahr, Elammaran Jayamani, Jagdish Patra, Lars Bergmann, Sanjay Shrirang Mane, Soon Kok Heng, Raj Sekar Sethu, Marco Erstling
Publikováno v:
2019 IEEE 9th International Nanoelectronics Conferences (INEC).
The polysilicon is a material widely used in an many electronic components. When circuits are placed underneath the bond pads, it is expected that their electrical properties are not impacted by any kind of thermo-mechanical stress. This paper presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::509edd182b6975793cfce235c3c9308a
https://doi.org/10.1109/inec.2019.8853844
https://doi.org/10.1109/inec.2019.8853844
Publikováno v:
Microelectronics Reliability. :113333
Polysilicon is an integral part of many devices in all CMOS processes. Circuit Under Pad (CUP) devices are required to have consistent and accurate electrical performance just like any other device. This paper presents an investigation on stress impa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7a85a63dfa5b3066de7e69101b76d86
https://doi.org/10.1016/j.microrel.2019.06.025
https://doi.org/10.1016/j.microrel.2019.06.025