Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Sanjay Malik"'
Wireless Body Area Network (WBAN) is a relatively new form of wireless networking technology that has found many potential uses, particularly in the medical field, thanks to its ability to give users a sense of independence even when they are being c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8347d4e47490fc770c5210dd56e5b733
https://doi.org/10.21203/rs.3.rs-2633617/v1
https://doi.org/10.21203/rs.3.rs-2633617/v1
Autor:
Pooja Malhotra, Sanjay Malik
Publikováno v:
SSRN Electronic Journal.
Autor:
Stuart Erickson, Sanjay Malik
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
With growing demand for advanced computing systems and as personal handheld devices become more powerful, frontend manufacturers are required to reduce the physical footprint of and at the same time integrate more functionality into their chips. More
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
As demand for ever more powerful personal handheld devices and advanced computing systems continues to grow, front-end manufacturers have pushed Moore's Law to the limit and integrated more functionality into their chips while at the same time reduci
Autor:
Ognian N. Dimov, Seongkuk Lee, Habib Hichri, Raj Sakamuri, Sanjay Malik, Markus Arendt, Venky Sundaran
Publikováno v:
International Symposium on Microelectronics. 2016:000025-000031
The continuous trend towards miniaturization, increasing performance and mobility of electronic devices drives interconnect density and integration, not only at the chip level, but also at interposer and package level. Silicon interposers coming from
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
There is a continuing need for higher density routing and heterogeneous integration of different devices, but also for continuous cost reduction. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The continued adoption of fan-out structures for advanced packaging and the rise of heterogeneous integration of different devices require several layers of interconnects, with feature sizes shrinking below 5 microns. Traditional organic flip-chip su
Autor:
Lee Seongkuk, Ye Chen, Ognian N. Dimov, Rao Tummala, Habib Hichri, Markus Arendt, Yuya Suzuki, Deepak Arora, Sanjay Malik, Kwon Sang Lee, Frank Wei, Venky Sundaram
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper reports the demonstration of 2-5 µm embedded trench formation in dry film polymer dielectrics such as Ajinomoto build-up film (ABF) and Polyimide without using chemical mechanical polishing (CMP) process. The trenches in these dielectrics
Publikováno v:
Journal of Photopolymer Science and Technology. 20:457-463
Fundamental immersion characteristics such as surface properties and leaching are reported for silicon-based materials. Incorporation of as little as 8% of silicon significantly increases film contact angle compared to single layer materials. Silicon
Autor:
Shinichi Kanna, Morio Yagihara, Tadayoshi Kokubo, Sanjay Malik, Kazuyoshi Mizutani, Stephanie Dilocker, Shoichiro Yasunami, Shiro Tan, Yasumasa Kawabe
Publikováno v:
Journal of Photopolymer Science and Technology. 16:595-600
Resist materials for 157 nm lithography is believed to be one of the key technology for producing patterns below 70 nm. Many different types of fluorine-containing polymer platforms have been energetically pursued by a number of researchers, and some