Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Sanil K. Daniel"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 638-644 (2019)
Thin film transistor (TFT) active matrix backplanes are used in large area electronic systems, such as displays and image sensors. With backplanes being fabricated on wearable and flexible substrates, the possibilities of operational faults in backpl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9ab492fb915cec1c8df07c8bf42bb18d
https://doi.org/10.1109/jeds.2019.2922000
https://doi.org/10.1109/jeds.2019.2922000
Publikováno v:
Innovative Data Communication Technologies and Application ISBN: 9783030380397
The road accidents and the fatalities are increasing day by day. Negligence in driving and the defiance of traffic rules are causing these accidents. Smarter vehicles embedded with sensors can alert the driver from violating the road traffic regulati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04a9c0fdc0ad6f5765d9d46fee4fdfb7
https://doi.org/10.1007/978-3-030-38040-3_75
https://doi.org/10.1007/978-3-030-38040-3_75
Autor:
K C Thushara, Sanil K Daniel
Publikováno v:
2018 International Conference on Emerging Trends and Innovations In Engineering And Technological Research (ICETIETR).
A start-up free bandgap voltage reference using piecewise curve rectification method in reducing the temperature coefficient, thus obtaining a stable output voltage with respect to temperature, is proposed. It uses piecewise nonlinear curve rectified
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ddfe9e33fd665e952de402f97e9c692
https://doi.org/10.1109/icetietr.2018.8529142
https://doi.org/10.1109/icetietr.2018.8529142
Publikováno v:
2018 3rd IEEE International Conference on Recent Trends in Electronics, Information & Communication Technology (RTEICT).
Large area electronic systems use either an active or passive matrix sensory back plane as the major component in the system design. These backplanes are vulnerable to interconnection errors and poor device performances. Hence reliability studies per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44a12739f852cc61edf572273a0ed269
https://doi.org/10.1109/rteict42901.2018.9012570
https://doi.org/10.1109/rteict42901.2018.9012570