Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Sangsub Song"'
Publikováno v:
Microwave and Optical Technology Letters. 52:750-753
In this article, the miniaturized resonator and bandpass filter for W-band application are suggested and evaluated on thin-film substrate.In the meanwhile, the resonator using the loading capacitor with the electrical length of 2λg/9 and the other r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a9b0aca3e0ec5a13293f02486a5e77b
https://doi.org/10.1002/mop.25011
https://doi.org/10.1002/mop.25011
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:101-108
In this paper, a system-on-package (SOP) technology using a thin-film substrate with a flip-chip interconnection has been developed for compact and high-performance millimeter-wave (mm-wave) modules. The thin-film substrate consists of Si-bumps, grou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2c97da15cffc362e3501477265ae6b2
https://doi.org/10.1109/tadvp.2008.2006626
https://doi.org/10.1109/tadvp.2008.2006626
Publikováno v:
IEICE Transactions on Electronics. :2232-2236
This paper presents the ultrawideband filters for UWB fullband (range of 3.1-10.6 GHz) applications. This filter consists of ring filter for wide-bandwidth and coupled line structure for suppressing unwanted passband in upper and lower stopbands. Esp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d802fb5435b043f081f2ab9ad2ba0fa
https://doi.org/10.1093/ietele/e90-c.12.2232
https://doi.org/10.1093/ietele/e90-c.12.2232
Autor:
Sangsub Song, Young-Min Kim, Youngwoo Kwon, Kwang-Seok Seo, Inchan Ju, Sang-Hyo Lee, Changyul Cheon, Jangsoo Lee
Publikováno v:
IEEE Microwave and Wireless Components Letters. 21:619-621
We report V-band fully integrated planar beam-steering Amplitude-Shift-Keying (ASK) transmitter (Tx) and receiver (Rx) system using advanced thin-film technology on a silicon (Si) mother board. BCB-on-Si System-on-Package (SOP) technology allows Rotm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d15fad9f4a4247bca0b042208842d138
https://doi.org/10.1109/lmwc.2011.2168601
https://doi.org/10.1109/lmwc.2011.2168601
Publikováno v:
IEEE Microwave and Wireless Components Letters. 20:205-207
This letter presents a W -band micromachined air-cavity bandpass filter (BPF) using a novel integration method of a micromachined silicon air-cavity resonator with silicon pillars. With silicon pillars, which were fabricated simultaneously with a dee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::325d83beb8aee039f652b723625eb12b
https://doi.org/10.1109/lmwc.2010.2042552
https://doi.org/10.1109/lmwc.2010.2042552
Publikováno v:
Microwave and Optical Technology Letters. 52:239-241
A 94 GHz low-cost frequency source has been developed using a 47 GHz micromachined air-cavity oscillator and a 47-to-94 GHz doubler on the thin-film substrate with the flip-chip interconnection. The 47 GHz micromachined air-cavity oscillator is a par
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d87014cac29f22b088cc59c6e0aeeee6
https://doi.org/10.1002/mop.24884
https://doi.org/10.1002/mop.24884
Autor:
Sangsub Song, Kwang-Seok Seo
Publikováno v:
IEEE Microwave and Wireless Components Letters. 19:200-202
In this letter, a W-band air-cavity filter has been developed on a thin-film substrate using a lossy silicon substrate as a base plate, which is suitable for a mm-wave system-on-package. The lossy silicon suppresses a parasitic substrate mode excited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b300c2a47f21330e5a03e238e96d5997
https://doi.org/10.1109/lmwc.2009.2015492
https://doi.org/10.1109/lmwc.2009.2015492
Publikováno v:
IEEE Microwave and Wireless Components Letters. 19:107-109
This letter presents a V-band cavity oscillator based on a thin-film substrate with a flip-chip interconnection. A cavity serves as a parallel-feedback element, which is fabricated using a micromachining technique and is flip-chip mounted on a thin-f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98ebec073d9cb8c3dccd7f5de48d802d
https://doi.org/10.1109/lmwc.2008.2011334
https://doi.org/10.1109/lmwc.2008.2011334
Publikováno v:
Japanese Journal of Applied Physics. 47:2535-2537
Embedded capacitors with available capacitances up to � 80 nF have been implemented on a thin-film multichip moduledeposited (MCM-D) substrate. By cost-effective silicon wet etching, a new metal–insulator–metal (MIM) structure named quasi-three
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8b2b06f38cf6c90abb47e23699b5711
https://doi.org/10.1143/jjap.47.2535
https://doi.org/10.1143/jjap.47.2535
Autor:
Changyul Cheon, Youngwoo Kwon, Young-Min Kim, Jangsoo Lee, Sangsub Song, Kwang-Seok Seo, Sanghyo Lee
Publikováno v:
IEEE Microwave and Wireless Components Letters. 18:287-289
We propose a planar V-band beam-steering antenna based on a millimeter-wave (mm-wave) system-on-package technology using advanced thin-film technology on a silicon mother board. The thin-film substrate has the capability of integrated passive element
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c38bbb680dfe9dc40116662a91494cce
https://doi.org/10.1109/lmwc.2008.918966
https://doi.org/10.1109/lmwc.2008.918966