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Autor:
Youngcheol Joo, Young-Chang Joo, Haishan Shen, Jeonglim Yoon, Cheol Hong Kim, Min-Woo Jeong, Sangkug Park, Hoo-Jeong Lee
Publikováno v:
Electronic Materials Letters. 15:686-692
Recently, mobile application processors (APs) have suffered from thermal issues such as local hot spot generation. Several approaches for chip cooling, such as dynamic thermal management, and heat pipe cooling, have been attempted so far, but, these
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23a0582993ea493f851c032f7ee31cf5
https://doi.org/10.1007/s13391-019-00167-2
https://doi.org/10.1007/s13391-019-00167-2
