Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sanghum Cho"'
Autor:
Injoon Son, Sanghum Cho, Jongchan Yoon, Kyung Tae Kim, Sung Hwa Bae, KwanHo Park, Ho-Sang Sohn
Publikováno v:
Journal of Nanoscience and Nanotechnology. 19:1738-1742
A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50 μm was deposited via electroplating onto the surface of a Bi₂Te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54e0c30a7e2947ffdc017bf376331bff
https://doi.org/10.1166/jnn.2019.16230
https://doi.org/10.1166/jnn.2019.16230
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:7603-7608
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54674494d77d4c998a9e69f601ef50b1
https://doi.org/10.1166/jnn.2017.14804
https://doi.org/10.1166/jnn.2017.14804
Autor:
Jongchan, Yoon, Sung Hwa, Bae, Ho-Sang, Sohn, Injoon, Son, KwanHo, Park, Sanghum, Cho, Kyung Tae, Kim
Publikováno v:
Journal of nanoscience and nanotechnology. 19(3)
A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::55bcb2528e6d37c26cd559561916f16b
https://pubmed.ncbi.nlm.nih.gov/30469257
https://pubmed.ncbi.nlm.nih.gov/30469257