Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Sangdoo Kim"'
Autor:
Deepak Gupta, Sravan Nandakumar, Takemasa Miyagi, Oliver Jan, Waheb Bishara, Steven Chiou, Kyeong-tae Lee, Andre Kim, Sangdoo Kim, Youngje Um, Ki-il Kim, Changbae Park, Myeonggil Shin, Keun Hee Bai
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning XII.
Autor:
Dan R. Littman, Randy S. Longman, Soyoung Ha, Sangdoo Kim, Kenya Honda, Gloria B. Choi, Jun R. Huh, Yeong Shin Yim, Koji Atarashi, Hyunju Kim, Tze Guan Tan
Publikováno v:
Nature. 549:528-532
Maternal immune activation (MIA) contributes to behavioural abnormalities associated with neurodevelopmental disorders in both primate and rodent offspring. In humans, epidemiological studies suggest that exposure of fetuses to maternal inflammation
Autor:
Ian R. Wickersham, Natalie Soares, Ari Waisman, Hyunju Kim, Ashley Park, Jun R. Huh, Sangdoo Kim, Leila M. Pascual, Gloria B. Choi, Joo Yeon Kim, Dan R. Littman, Yeong Shin Yim, Janet Berrios, Mark T. Harnett, Mathieu Lafourcade
Publikováno v:
Nature
Immunity
Immunity
Viral infection during pregnancy is correlated with increased frequency of neurodevelopmental disorders, and this is studied in mice prenatally subjected to maternal immune activation (MIA). We previously showed that maternal T helper 17 cells promot
Autor:
Gloria B. Choi, Dan R. Littman, Sangdoo Kim, Hyunju Kim, Sangwon V. Kim, Charles A. Hoeffer, Helen Wong, Jun R. Huh, Yeong Shin Yim
Publikováno v:
Science. 351:933-939
A T cell cause for autism? The causes of autism spectrum disorder (ASD) are complex and not entirely clear. Alterations in the mother's immune system during pregnancy, especially during key early periods of fetal neurodevelopment, may play a role. Ch
Autor:
Tze-Chiang Huang, Jungi Choi, Vivek Chickermane, Hayden Hyungdong Lee, Min-Jer Wang, Saman M. I. Adham, Sandeep Kumar Goel, Sangdoo Kim, Ashok B. Mehta, Subhasish Mukherjee, Ji-Jan Chen, Brion Keller, Jeongho Cho, Navdeep Sood, Thomas Valind, Frank Lee
Publikováno v:
Handbook of 3D Integration
Recent advances in semiconductor process technology especially interconnects using Through Silicon Vias (TSVs) enable the heterogeneous system integration where dies are implemented in dedicated, optimized process technologies and stacked in a 3D for
Autor:
Choi, Gloria B.1, Yeong S. Yim1, Helen Wong2,3, Sangdoo Kim4, Hyunju Kim4, Sangwon V. Kim5, Hoeffer, Charles A.2,3 charles.hoeffer@colorado.edu, Littman, Dan R.5,6 dan.littman@med.nyu.edu, Jun R. Huh4,5 jun.huh@umassmed.edu
Publikováno v:
Science. 2/26/2016, Vol. 351 Issue 6276, p933-939. 7p.