Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Sang-Mao Chiu"'
Autor:
Sang-Mao Chiu, 邱桑茂
92
The miniaturization of electronic components causes the signal delay phenomenon to become increasingly pronounced, and hence limits the ability of these devices to satisfy the requirements of high frequency and high-speed transmission. An eff
The miniaturization of electronic components causes the signal delay phenomenon to become increasingly pronounced, and hence limits the ability of these devices to satisfy the requirements of high frequency and high-speed transmission. An eff
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/54259525764899142757
Autor:
Sang Mao Chiu, Yeau-Ren Jeng
Publikováno v:
Journal of Electronic Materials. 35:279-283
This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric ox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::022b2d4e4f64e445b5f3f5eb776523a5
https://doi.org/10.1007/bf02692447
https://doi.org/10.1007/bf02692447
Publikováno v:
Electrochemical and Solid-State Letters. 7:G335
The wire bonding of chips with copper interconnects is a challenging issue. The present study develops a method in which the substrates are stored in a temperature and humidity controlled environment such that copper oxide films of appropriate thickn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9394ce00c6e3aad422030ff82774b00b
https://doi.org/10.1149/1.1819853
https://doi.org/10.1149/1.1819853
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing; Jan2010, Vol. 33 Issue 1, p65-70, 6p
Autor:
Yeau Ren Jeng, Sang Mao Chiu
Publikováno v:
Journal of Electronic Materials; Feb2006, Vol. 35 Issue 2, p279-283, 5p, 5 Graphs