Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Sang Phill Park"'
Autor:
Sang Phill Park, Ulya R. Karpuzcu, Nitin Borkar, Dinesh Somasekhar, Ayan Paul, Young Moon Kim, Chris H. Kim
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 24:3468-3476
In this paper, we study two different ON-chip power delivery schemes, namely, fully integrated voltage regulator (FIVR) and low-dropout regulator (LDO), and analyze their effect on total system power under process variation, assuming a realistic dyna
Autor:
Niladri Narayan Mojumder, Kaushik Roy, Charles Augustine, Xuanyao Fong, Sang Phill Park, Sri Harsha Choday
Publikováno v:
IEEE Sensors Journal. 12:756-766
Electron-spin based data storage for on-chip memories has the potential for ultrahigh density, low power consumption, very high endurance, and reasonably low read/write latency. In this article, we analyze the energy-performance characteristics of a
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20:248-256
Radiation-induced soft error rate (SER) degrades the reliability of static random access memory (SRAM)-based field programmable gate arrays (FPGAs). This paper presents a new built-in 2-D Hamming product code (2-D HPC) scheme to provide reliable oper
Publikováno v:
IEEE Transactions on Electron Devices. 58:3837-3846
In this paper, we present tri-mode independent-gate (IG) FinFETs for dynamic voltage/frequency scalable 6T SRAMs. The proposed design exploits the fact that the spacer patterning technology, used for FinFET fabrication, offers the same device footpri
Publikováno v:
IEEE Electron Device Letters. 35:488-490
A novel nonvolatile flip-flop (NVFF) using a magnetic tunnel junction (MTJ) is presented for power gating architecture. The proposed NVFF exploits spin Hall effect (SHE) for fast and low-power data backup into MTJs before the power is gated off. Owin
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 18:270-280
Performance variability in digital integrated circuits can largely affect parametric yield and product reliability in ultra deep submicrometer technologies. As a result, variation resilience is becoming an essential design requirement for future tech
Publikováno v:
IEEE Journal of Solid-State Circuits. 45:401-410
Supply voltage scaling is one of the easiest ways to reduce energy dissipation. Therefore, researchers have considered subthreshold logic as a promising option to achieve ultra low energy dissipation. However, circuit propagation delay is extremely s
Publikováno v:
IEEE Design & Test of Computers. 26:8-17
Bias temperature instability (BTI) is one of the major reliability challenges in nanoscale CMOS technology. This article investigates the severity of such degradation in logic and memory circuits. The simulation results reveal that BTI poses severe c
Publikováno v:
ISLPED
Spin transfer torque magnetic random access memory (STT MRAM) is a promising non-volatile memory due to its outstanding potential for high integration density and excellent scalability. Despite the attractive features, high write current and power is
Autor:
Sang Phill Park, Kaushik Roy, Sumeet Kumar Gupta, Niladri Narayan Mojumder, Anand Raghunathan
Publikováno v:
DAC
Spin-transfer torque magnetic RAM (STT MRAM) has emerged as a promising candidate for on-chip memory in future computing platforms. We present a cross-layer (device-circuit-architecture) approach to energy-efficient cache design using STT MRAM. At th