Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Sandy Klengel"'
Beim Polymerverguss zur Kapselung elektronischer Steuerungen und Sensoren sind Eigenspannungen bedingt durch raue Umgebungsbedingungen mit Temperaturwechseln eine große Herausforderung. Neuartige stressreduzierende Vergussmassen können die Problema
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::383e6ca858ae874dd15547d13d9018ae
https://publica.fraunhofer.de/handle/publica/442174
https://publica.fraunhofer.de/handle/publica/442174
Autor:
Robert Klengel, Sandy Klengel, Sebastian Tismer, Thomas Ackermann, Noritoshi Araki, Motoki Eto, Teruo Haibara, Takashi Yamada, Jochen Feldmann, Ralph Binner, Henk Peters, Achim Scheer, Vincent Chee
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Teruo Haibara, Takashi Yamada, Robert Klengel, Noritoshi Araki, Jan Schischka, Motoki Eto, Sandy Klengel
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Silver (Ag) bonding wires are mainly used in consumer products as a reliable low-cost alternative to gold (Au) bonding wires. In automotive applications, the materials are exposed to particularly harsh environmental conditions. In order to understand
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Additive manufacturing of copper structures with selective laser melting offers promising possibilities for prototyping or production of unconventional structures for electronic assemblies. There are various copper powders from different manufacturer
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Corrosion occurs on metallic materials in the presence of moisture and reactive gases, such as H 2 S, SO 2 or NO 2 and is enhanced by different substances like e.g. chlorides. Particularly electronic materials and components are affected, because the
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
By today, die bonding on flexible circuit boards is only possible with adhesive connections or can be realized in combination by rigid-flex technology via soldering. The flex technology has a big potential with regard to new application fields such a
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
During the past ten years, copper (Cu) bond wires have increasingly replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environ
Autor:
Robert Klengel, Takashi Yamada, Tino Stephan, Motoki Eto, Jan Schischka, Sandy Klengel, Matthias Petzold, Noritoshi Araki
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
During the past ten years, copper (Cu) bond wires have extensively replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environm
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9783030316792
In the present study, the breakdown and aging performance of two PBT materials at different environmental conditions are under investigation. For this purpose, the electrical short-term strength is determined for AC and DC with two different voltage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e2053e4b17e1eaea5a30d1b6ab8853f
https://doi.org/10.1007/978-3-030-31680-8_48
https://doi.org/10.1007/978-3-030-31680-8_48
Autor:
Tino Stephan, Jan Schischka, Robert Klengel, Noritoshi Araki, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We present studies for a newly developed gold-palladium coated copper wire with focus to the automotive industry. This wire material was designed to prevent halide induced interface corrosion and also sulphur induced pitting corrosion. The base mater