Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Sandra Fries-Carr"'
Autor:
Lianggou Hong, Kevin Wiacek, Timothy J. Bunning, Kurt G. Eyink, Hao Jiang, Sandra Fries-Carr, N. Venkatasubramanian, John T. Grant, Jesse Enlow
Publikováno v:
Thin Solid Films. 515:3513-3520
Polymer dielectric films fabricated by plasma enhanced chemical vapor deposition (PECVD) have unique properties due to their dense crosslinked bulk structure. These spatially uniform films exhibit good adhesion to a variety of substrates, excellent c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a63e8857057c2136bf59745c57b1923
https://doi.org/10.1016/j.tsf.2006.10.126
https://doi.org/10.1016/j.tsf.2006.10.126
Publikováno v:
Advances in Electronic and Electrochemical Ceramics, Volume 179
Capacitors are a pervasive technology in every military and commercial application. Millions are used in electronic power systems and are considered to be a critical link to a common area of failure. Capacitors often fail under raised temperature con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::123d628e1a3c4296b04f15b78142b969
https://doi.org/10.1002/9781118407899.ch5
https://doi.org/10.1002/9781118407899.ch5
Publikováno v:
Applied Physics Letters. 76:849-851
P-type diamond layers have been produced in polycrystalline diamond by means of rapid thermal diffusion (RTD) of boron. Using thin film of deposited boron as the source and temperatures near 1600 °C, solid-state diffusion of boron was achieved, form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a8e9fa21b2ae99078432aabd493ec2f
https://doi.org/10.1063/1.125605
https://doi.org/10.1063/1.125605
Publikováno v:
IECEC-97 Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH6203).
Thin BaTiO/sub 3/ film (5000 Angstroms) capacitor devices were fabricated by using RF sputtering techniques and applying various levels of oxygen-rich environments (0% to 20%). In this study, the gas compositions were specifically 100% Ar and the var
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b275bab5c3c99081d04a1ce39b105c84
https://doi.org/10.1109/iecec.1997.659207
https://doi.org/10.1109/iecec.1997.659207
Publikováno v:
SAE Technical Paper Series.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc0ad2fa68120b3531ab6b09dbd25bd3
https://doi.org/10.4271/1999-01-2596
https://doi.org/10.4271/1999-01-2596
Publikováno v:
MRS Proceedings. 446
BaTiO3 films prepared by RF sputtering was studied for capacitor applications. Some films produced have a capacitance storage of 0.85 μF/cm2, a high resistivity of 1014 ω‐cm, and a low dissipation factor of 0.005. The dielectric constant of these
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::65fbbfb30aab14044d0ac68dfebad466
https://doi.org/10.1557/proc-446-343
https://doi.org/10.1557/proc-446-343
Publikováno v:
AIP Conference Proceedings.
This research activity attempts to develop an ultra‐thin capacitor using TiO2 as a dielectric film for high‐temperature microelectronics in commerical or military applications. There has been an increasing demand for a high dielectric constant in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5091996c02031e022fdd3452b2cbcc4e
https://doi.org/10.1063/1.47212
https://doi.org/10.1063/1.47212
Autor:
B. H. Tsao, M. L. Ramalingam, R. S. Bhattacharya, Sandra Fries Carr, Mohamed S. El-Genk, Mark D. Hoover
Publikováno v:
AIP Conference Proceedings.
An advanced capacitor using SiC as the dielectric material has been developed for high temperature, high power, and high density electronic components for aircraft and aerospace application. The conventional capacitor consists of a large number of me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ddb9fdbc0e3ded61e19eec3aea5ed6e
https://doi.org/10.1063/1.2950128
https://doi.org/10.1063/1.2950128
Autor:
Sandra Fries-Carr, Hao Jiang, Kurt G. Eyink, Kevin Wiacek, Timothy J. Bunning, John T. Grant, N. Venkatasubramanian, Thuy D. Dang, Lianggou Hong, Paul Fleitz
Publikováno v:
Scopus-Elsevier
Polymer dielectric films fabricated by plasma enhanced chemical vapor deposition (PECVD) have inherent superiority due to their smooth surface, pin-hole free morphology, and dense crosslinked bulk structure. These spatially uniform films also exhibit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::32c5cf019c20dfd9b61e80cf679aa480
https://doi.org/10.1179/mri.2006.10.3.lxxxii
https://doi.org/10.1179/mri.2006.10.3.lxxxii
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