Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Sandeep Shantaram"'
Publikováno v:
IMAPSource Proceedings. 2022
Automobiles have witnessed rapid proliferation of infotainment, driver assistance and autonomous driving features which have led to significant increase in semiconductor content per car. However, this has also required increased integration of device
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba7f6b1d5d2d8d1cb21d7ae004d845f2
https://doi.org/10.4071/001c.74750
https://doi.org/10.4071/001c.74750
Publikováno v:
International Symposium on Microelectronics. 2017:000304-000311
Delamination at the mold compound and leadframe interface is the most common failure mode observed during processing and qualification of the microelectronic package. Mold compound to leadframe delamination is typically observed after environmental r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9f93280dc1343b682ea9b8307298f2f
https://doi.org/10.4071/isom-2017-wa53_009
https://doi.org/10.4071/isom-2017-wa53_009
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Stringent requirements on semiconductor devices targeted for automotive mission profiles are challenging the thermomechanical performance of packaging materials. One typical failure mode is solder mask cracks, which is a significant concern for FCPBG
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8c227c9cd9d2f6e787cabf7685bab80
https://doi.org/10.1109/itherm.2019.8757373
https://doi.org/10.1109/itherm.2019.8757373
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This paper presents a method to predict the copper-pillar solder bump fatigue in a flip-chip device under accelerated stress testing (automotive grade) involving multi-physics via commercially available FE platform. Comparative analysis between air-t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91344f7a8dd509fe00d0aff943e47e40
https://doi.org/10.1109/itherm.2018.8419550
https://doi.org/10.1109/itherm.2018.8419550
Publikováno v:
International Symposium on Microelectronics. 2015:000696-000701
Scanning acoustic microscopy (SAM) is the primary method to non-destructively detect internal defects in finished semiconductor packages. SAM is heavily used to detect interfacial delamination in the die-package system. Though this method can achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7ded4992c0976836cdbf9288ced99d5
https://doi.org/10.4071/isom-2015-tha61
https://doi.org/10.4071/isom-2015-tha61
Autor:
David Samet, Ilko Schmadlak, Suresh K. Sitaraman, Torsten Hauck, Sandeep Shantaram, Nishant Lakhera, V. N. N. Trilochan Rambhatla
Publikováno v:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Fracture mechanics is an essential field of study towards the improvement and development of electronic packages. In combination with modern simulation method such as finite element analysis (FEA), fracture mechanics is widely used and appreciated in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7e949dad4b8ce22549e88f45234c4c8
https://doi.org/10.1115/ipack2017-74073
https://doi.org/10.1115/ipack2017-74073
Autor:
Torsten Hauck, Sandeep Shantaram
Publikováno v:
International Symposium on Microelectronics. 2014:000037-000043
This paper presents a methodology to predict warpage of ball grid array packages (BGAs) that takes into account details of metal designs in the multi layered substrate. Composite theory along with local homogenization methods are used to resolve the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3910599ab77b1a83bec69e9b9708649b
https://doi.org/10.4071/isom-ta22
https://doi.org/10.4071/isom-ta22
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 32:311-324
In this paper, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-leadfree solder alloy systems. Solder alloy systems inves
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61c6655d07cd6c865248db1f4ca7ed0d
https://doi.org/10.1109/tepm.2009.2031873
https://doi.org/10.1109/tepm.2009.2031873
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 32:378-395
Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling and during normal usage. Measurement of transient dynamic deformation of the electronics assemblies during the shock and vibration can yield significant insig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a55f622817b5294aa02e0376c1fe9cd1
https://doi.org/10.1109/tcapt.2009.2020915
https://doi.org/10.1109/tcapt.2009.2020915
Publikováno v:
Journal of Electronic Packaging. 137
Electronic products are subjected to high G-levels during mechanical shock and vibration. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. The second-level interconnects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3be8da3a5d4b683c19237478bfd3bf0
https://doi.org/10.1115/1.4028641
https://doi.org/10.1115/1.4028641