Zobrazeno 1 - 10
of 76
pro vyhledávání: '"Sanborn, R. H."'
Autor:
Souers, P. C., Fearon, D., Garza, R., Kelly, E. M., Roberts, P. E., Sanborn, R. H., Tsugawa, R. T., Huntb), J. L., Pollb), J. D.
Publikováno v:
Journal of Chemical Physics; Feb1979, Vol. 70 Issue 4, p1581-1584, 4p
Autor:
Zhuang, Zhiqiang1 (AUTHOR), Qian, Zhihui1,2 (AUTHOR) zhqian@jlu.edu.cn, Wang, Xu1 (AUTHOR), Xu, Xiaolin3 (AUTHOR), Chen, Boya1 (AUTHOR), Song, Guangsheng1 (AUTHOR), Liu, Xiangyu1 (AUTHOR) liuxy91@jlu.edu.cn, Ren, Lei1,2,4 (AUTHOR) lren@jlu.edu.cn, Ren, Luquan1,2 (AUTHOR)
Publikováno v:
Advanced Science. 2/2/2024, Vol. 11 Issue 5, p1-12. 12p.
Publikováno v:
Chemistry - A European Journal. 7/6/2023, Vol. 29 Issue 38, p1-24. 24p.
Publikováno v:
Organic Geochemistry; 1998, Vol. 28 Issue: 11 p755-758, 4p
Publikováno v:
Conservar Património; set2024, Vol. 47, p12-27, 16p
Autor:
Jiang, Bo1 (AUTHOR), Jiao, Huan1 (AUTHOR), Guo, Xinyu1 (AUTHOR), Chen, Gegu2 (AUTHOR), Guo, Jiaqi1 (AUTHOR), Wu, Wenjuan1 (AUTHOR), Jin, Yongcan1 (AUTHOR) jinyongcan@njfu.edu.cn, Cao, Guozhong3 (AUTHOR) gzcao@u.washington.edu, Liang, Zhiqiang4 (AUTHOR) zqliang@suda.edu.cn
Publikováno v:
Advanced Science. 3/24/2023, Vol. 10 Issue 9, p1-33. 33p.
Publikováno v:
Chemistry - An Asian Journal. Mar2023, Vol. 18 Issue 5, p1-18. 18p.
Autor:
Jia, Ben, Huang, Heyuan, Dong, Zhicheng, Ren, Xiaoyang, Lu, Yanyan, Wang, Wenzhi, Zhou, Shaowen, Zhao, Xin, Guo, Baolin
Publikováno v:
Chemical Society Reviews; 4/21/2024, Vol. 53 Issue 8, p4086-4153, 68p
Autor:
Sokoloff, J. B.
Publikováno v:
Journal of Applied Physics; 9/28/2022, Vol. 132 Issue 12, p1-8, 8p
Autor:
Chung C; Department of Mechanical Engineering, University of Colorado Denver, Denver, CO, 80217, USA., Jiang H; Department of Mechanical Engineering, University of Colorado Denver, Denver, CO, 80217, USA., Yu K; Department of Mechanical Engineering, University of Colorado Denver, Denver, CO, 80217, USA.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Nov; Vol. 20 (47), pp. e2402305. Date of Electronic Publication: 2024 Aug 18.