Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Sanaz Yazdanparast"'
Publikováno v:
3D Printing and Additive Manufacturing.
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 20:609-612
The structural and electrical property changes of two types of copper oxides (CuO and Cu2O) under voltage bias are studied with in situ transmission electron microscopy (TEM). The phases of different materials are confirmed with electron diffraction.
Publikováno v:
Physica B: Condensed Matter. 637:413909
Autor:
Annika Fash-White, Garritt J. Tucker, Sanaz Yazdanparast, Geoff L. Brennecka, Sina Soltanmohammad
Publikováno v:
ACS applied materialsinterfaces. 12(17)
MXenes are emerging two-dimensional (2D) materials for energy-storage applications and supercapacitors. Their surface chemistry, which determines critical properties, varies due to different synthesis conditions. In this work, we synthesized TiVC sol
Autor:
Sanaz Yazdanparast
Publikováno v:
Applied Surface Science. 389:632-638
Cuprous oxide (Cu 2 O) thin films were electrodeposited cathodically from a highly alkaline bath using tartrate as complexing agent. Different microstructures for Cu 2 O thin films were achieved by varying the applied potential from −0.285 to −0.
The structural, elastic and electronic properties of two-dimensional (2D) titanium carbide/nitride based pristine (Tin+1Cn/Tin+1Nn) and functionalized MXenes (Tin+1CnT2/Tin+1NnT2, T stands for the terminal groups: -F, -O and -OH, n = 1, 2, 3) are inv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b589c35e79c4568f8059a34b7962169
Copper Nanofilament Formation during Unipolar Resistance Switching of Electrodeposited Cuprous Oxide
Publikováno v:
Chemistry of Materials. 27:5974-5981
An emerging nonvolatile, solid-state memory is resistance random access memory (RRAM). RRAM is based on reversible switching of resistance in semiconductor and insulator thin films. Here, unipolar resistance switching is demonstrated in electrodeposi
Publikováno v:
Materials Science and Engineering: A. 527:5831-5836
In this research, embedment of HA-2 wt.% Ti composite powder on superplastic Ti–6Al–4V was conducted through continuous pressing technique to improve the low strength of the conventional pure HA coatings. The embedment process was carried out at
Copper Nanofilament Formation during Unipolar ResistanceSwitching of Electrodeposited Cuprous Oxide.
Publikováno v:
Chemistry of Materials; Sep2015, Vol. 27 Issue 17, p5974-5981, 8p
Publikováno v:
2D Materials; Oct2018, Vol. 5 Issue 4, p1-1, 1p