Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Samuel Lytwynec"'
Publikováno v:
IMAPSource Proceedings. 2022
Sn-based high-temperature lead-free (HTLF) solder pastes have been developed as a drop-in solution to replace the high-Pb solder pastes in power discrete applications. The pastes were designed to combine the merits of two constituent powders. A SnSb-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99bc0d45f316f86cbc8e0a74211c1cad
https://doi.org/10.4071/001c.74628
https://doi.org/10.4071/001c.74628
Publikováno v:
International Symposium on Microelectronics. 2021:000356-000361
Development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment in power device applications is driven by (1) the harmful effects of lead to human health and the environment, and (2) the demand of the improved
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c7c32b5c2f293f9bb5ceae25598a225
https://doi.org/10.4071/1085-8024-2021.1.000356
https://doi.org/10.4071/1085-8024-2021.1.000356
Publikováno v:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::70b1065e581fd7b4190f940b9ecd3e7c
https://doi.org/10.1109/iemt55343.2022.9969470
https://doi.org/10.1109/iemt55343.2022.9969470
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b54fe487006a1b18341c92fad12cb685
https://doi.org/10.23919/icep55381.2022.9795597
https://doi.org/10.23919/icep55381.2022.9795597
Autor:
Jenny Gallery, Samuel Lytwynec
Publikováno v:
High-Power Diode Laser Technology XX.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb267feb5ebad55273c8a2acc7ea9bfc
https://doi.org/10.1117/12.2610113
https://doi.org/10.1117/12.2610113
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb2dcd66f492aaf6979364fbc7d00c4a
https://doi.org/10.1109/impact53160.2021.9696537
https://doi.org/10.1109/impact53160.2021.9696537
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Durafuse™ LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock performance. It is formulated with the mixed solder powder te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a68ac1b7afbb1fa68c0244ba99749954
https://doi.org/10.1109/ectc32696.2021.00113
https://doi.org/10.1109/ectc32696.2021.00113