Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Sami Ul Islam Sami"'
Autor:
Md Sami Ul Islam Sami, Tao Zhang, Amit Mazumder Shuvo, Md Saad Ul Haque, Paul E. Calzada, Kimia Zamiri Azar, Hadi Mardani Kamali, Fahim Rahman, Farimah Farahmandi, Mark Tehranipoor
Publikováno v:
IEEE Access, Vol 12, Pp 48081-48107 (2024)
The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome the slowdown in Moore’s Law and Dennard scaling and to resp
Externí odkaz:
https://doaj.org/article/e06012ab5b6e46eab6276bb8384472df
Autor:
Md Sami Ul Islam Sami, Hadi Mardani Kamali, Farimah Farahmandi, Fahim Rahman, Mark Tehranipoor
Publikováno v:
IEEE Design & Test. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b6f37a8a4c6ce8b9976937ed24aea79
https://doi.org/10.1109/mdat.2023.3270234
https://doi.org/10.1109/mdat.2023.3270234
Autor:
Md Sami Ul Islam Sami, Fahim Rahman, Adam Cron, Dale Donchin, Mike Borza, Farimah Farahmandi, Mark Tehranipoor
Publikováno v:
2021 IEEE International Symposium on Hardware Oriented Security and Trust (HOST).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a07d2269e0c41301fe1d0bff5430271
https://doi.org/10.1109/host49136.2021.9702285
https://doi.org/10.1109/host49136.2021.9702285
Autor:
Mark Tehranipoor, Sami Ul Islam Sami, Farimah Farahmandi, Fahim Rahman, Mike Borza, Adam Cron
Publikováno v:
DAC
The pursuit of manufacturing cost reduction reshaped the conventional system-on-chip (SoC) design and manufacturing flow into the horizontal business model. In this model, the design house loses control of the design during the manufacturing process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53d12372a6ab94ddd344c26222b69537
https://doi.org/10.1109/dac18074.2021.9586106
https://doi.org/10.1109/dac18074.2021.9586106
Publikováno v:
Emerging Topics in Hardware Security ISBN: 9783030644475
In the era of intelligent manufacturing, Digital Twin is an emerging technology that has attracted a huge attention in industry. Digital Twin has been discussed extensively, but they are separated in different research areas. This paper reviews the e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c9438b30d73bd39919d0dbf256ad8e5
https://doi.org/10.1007/978-3-030-64448-2_2
https://doi.org/10.1007/978-3-030-64448-2_2
Publikováno v:
2016 IEEE 6th International Conference on Photonics (ICP).
Nano-particles have the potential to couple incident sunlight into localized modes, reducing reflection and increasing absorption, thereby significantly improving the performance of thin film solar cells. In this article, a plasmonic solar cell has b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ee236e72ce97a9857744a13fd4a63f
https://doi.org/10.1109/icp.2016.7509994
https://doi.org/10.1109/icp.2016.7509994