Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Samantha Donavan"'
Autor:
Thomas A. Wassick, John P. Cincotta, Oswaldo Chacon, Theo Anemikos, Hugues Gagnon, Robert Martel, Charles Carey, Samantha Donavan, Zhuo-Jie Wu, Patrick Justison, Doug Hunt
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
To enable higher computing power in a single chip, there is demand for increasing die size for high performance applications in advanced nodes. Due to the weak mechanical properties of the low-k and ultra low-k (ULK) dielectrics in advanced technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827d306934b3c59182bc6a6e98937ffe
https://doi.org/10.1109/ectc.2018.00104
https://doi.org/10.1109/ectc.2018.00104
