Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Saman Jafarlou"'
Autor:
Matthew Streshinsky, Lei Wang, Ari Novack, Yogi Ahuja, Rhys Manley, Patrick Maupin, Hao Wu, Jinghui Yang, Fen Guan, Romanas Narevich, Chris Horng, Noam Ophir, Jiahao Zhan, Jim Mali, Wuchun Wu, Katherine Roelofs, Yun Zhe Li, Vesselin Velev, Babak Behnia, Brian West, Artsroun Darbinian, Gabriel Thompson, George Zarris, Xavier Serey, Saman Jafarlou, Matthew Chang, Shahab Ardalan, Thomas Baehr-Jones
We demonstrate a transmitter and receiver in a silicon photonics platform for O-band optical communication that monolithically incorporates a modulator driver, traveling-wave Mach-Zehnder modulator, control circuitry, photodetector, and TIA in the Gl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2c949e8a3d30ab952609741775ddd2d5
https://doi.org/10.1364/opticaopen.22814837.v1
https://doi.org/10.1364/opticaopen.22814837.v1
Publikováno v:
IEEE Journal of Solid-State Circuits. 55:282-297
A CMOS 170-GHz fundamental-frequency transmitter (TX) realizing the 8PSK modulation scheme directly in the RF domain is presented. The use of direct RF modulation obviates the need for high-resolution high-speed mixed-signal blocks. The proposed arch
Publikováno v:
IEEE Transactions on Antennas and Propagation. 67:1605-1619
Compact phased-array antennas embedded in flip-chip ball grid array (BGA) packages are proposed to operate over the unlicensed 60 GHz frequency band. Radiation properties are enhanced by designing novel corrugated soft-surface structures and implemen
Publikováno v:
IEEE Journal of Solid-State Circuits. 52:3293-3311
This paper presents the design and implementation of a millimeter-wave fundamental frequency circularly polarized radiator, which employs a multi-port cavity as the core of a high- $Q$ resonator, a power combiner, and an antenna. A general theory of
Autor:
A. Tomkins, Eric Juntunen, Arash Tabibiazar, Ahmed Abdellatif, Saman Jafarlou, Yat-Loong To, Mihai Tazlauanu, Alan Poon, Brad Lynch, Grigori Temkine, Hatem Tawfik, Ronald Glibbery, Ahmed M. El-Gabaly, Mohammad Fakharzadeh, Craig Farnsworth
Publikováno v:
IEEE Journal of Solid-State Circuits. 50:2239-2255
A fully integrated 802.11ad/WiGig compliant 60 GHz transceiver is presented in a 130 nm SiGe BiCMOS technology. Encompassing an area of 2.3 mm $\, \times \,$ 2.16 mm $=$ 4.97 mm $^{2}$ , the transceiver covers the entire 60 GHz band, from 57 to 66 GH
Publikováno v:
2017 IEEE MTT-S International Microwave Symposium (IMS).
This paper presents two types of wideband transitions from a flip-chip interconnect to external v-band rectangular waveguides and surface-mount coaxial connectors, based on LTCC technology. The flip-chip interconnect is directly connected to a multi-
Publikováno v:
ISSCC
Circular-polarized (CP) radiation is found to be a viable choice for imaging/sensing applications by offering faster scan time and robust source-detector alignment compared to linear radiation [1]. Power-efficient generation of a low-noise, high-powe
Autor:
Zahra Sotoodeh, Saman Jafarlou, Mohammad Fakharzadeh, Maher Bakri-Kassem, Safieddin Safavi-Naeini
Publikováno v:
IEEE Transactions on Antennas and Propagation. 62:6010-6018
This paper presents a high-efficiency wideband planar dielectric tapered antenna designed for 60-GHz integrated applications fabricated through a novel process compatible with silicon technology. The antenna is composed of five parts: a CPW line, a b
Autor:
Saman Jafarlou, Mohammad Fakharzadeh
Publikováno v:
IEEE Microwave and Wireless Components Letters. 25:370-372
This letter describes a broadband CPW to standard WR-15 rectangular waveguide transition designed for low-cost PCB technology. This low-loss transition can be be directly integrated to a flip-chipped millimetre-wave integrated circuit. The measured f
Publikováno v:
2016 IEEE International Symposium on Antennas and Propagation (APSURSI).
This paper describes a systematic approach to characterize flip-chip solder bump interconnects to accurately design mm-wave on-chip devices and matching circuits for on-package components. Variety of on-chip test structures are fabricated and measure