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Autor:
S. Joshi, Peter Borgesen, Babak Arfaei, Richard J. Coyle, Sam Mahin-Shirazi, James R. Wilcox, Eric J. Cotts, Martin Anselm
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Previously crack propagation and joint failure in thermal cycling tests were correlated with recrystallization of Sn grains in SnAgCu (SAC) ball grid array (BGA) solder joints. Generally recrystallization of the Sn grains was observed to occur in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8de34f673f9b96fa10b2c4c58ea4df2
https://doi.org/10.1109/ectc.2013.6575693
https://doi.org/10.1109/ectc.2013.6575693
