Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Sam Gu"'
Autor:
Mehul Vora, Mitalie Shah, Silvana Ostafi, Brian Onken, Jian Xue, Julie Zhouli Ni, Sam Gu, Monica Driscoll
Publikováno v:
PLoS Genetics, Vol 9, Iss 8, p e1003737 (2013)
Caloric/dietary restriction (CR/DR) can promote longevity and protect against age-associated disease across species. The molecular mechanisms coordinating food intake with health-promoting metabolism are thus of significant medical interest. We repor
Externí odkaz:
https://doaj.org/article/681881f70e31431a88d94fc2ab2b1037
Autor:
Zoran Gajic, Diljeet Kaur, Julie Ni, Zhaorong Zhu, Anna Zhebrun, Maria Gajic, Matthew Kim, Julia Hong, Monika Priyadarshini, Christian Frøkjær-Jensen, Sam Gu
Publikováno v:
Development (Cambridge, England). 149(16)
Despite the prominent role of endo-siRNAs in transposon silencing, their expression is not limited to these ‘nonself’ DNA elements. Transcripts of protein-coding genes (‘self’ DNA) in some cases also produce endo-siRNAs in yeast, plants and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5bd89e9f2bae63ec2fc0d2f99c6b973a
https://pubmed.ncbi.nlm.nih.gov/35876680
https://pubmed.ncbi.nlm.nih.gov/35876680
Autor:
Zoran Gajic, Diljeet Kaur, Julie Ni, Zhaorong Zhu, Anna Zhebrun, Maria Gajic, Matthew Kim, Julia Hong, Monika Priyadarshini, Christian Frøkjær-Jensen, Sam Gu
Despite their prominent role in transposon silencing, expression of endo-siRNAs is not limited to the “non-self” DNA elements. Transcripts of protein-coding genes (“self” DNA) in some cases also produce endo-siRNAs in yeast, plants, and anima
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86b49cc528b061007228caec89f9d970
https://doi.org/10.1101/2022.01.25.477739
https://doi.org/10.1101/2022.01.25.477739
Publikováno v:
Scripta Materialia. 119:9-12
Au surface finishing on Ni layer in solder joints can lead to the replacement of β-Sn by (Au, Ni)Sn 4 phase in microbumps. A thorough crack in (Au, Ni)Sn 4 is found after the sample being annealed at 150 °C for 1000 h. Phase transformation of (Au,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f916e9cdcab3d45d2cd9f0b6c1f7454
https://doi.org/10.1016/j.scriptamat.2016.02.025
https://doi.org/10.1016/j.scriptamat.2016.02.025
Publikováno v:
Journal of Applied Physics; 10/7/2015, Vol. 118 Issue 13, p135304-1-135304-5, 5p, 2 Black and White Photographs, 3 Diagrams, 1 Chart, 3 Graphs
Publikováno v:
Transactions on Combinatorics, Vol 12, Iss 1, Pp 11-26 (2023)
The probability that a random permutation in $S_n$ is a derangement is well known to be $\displaystyle\sum\limits_{j=0}^n (-1)^j \frac{1}{j!}$. In this paper, we consider the conditional probability that the $(k+1)^{st}$ point is fixed, given there a
Externí odkaz:
https://doaj.org/article/0432061e63b04eccb73797a37a02b7b3
Publikováno v:
Scripta Materialia. 102:39-42
A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0bf1594747b4ca65924c86baae7adf4a
Autor:
Aurel Gunterus, M. F. Chen, Urmi Ray, Matt Nowak, Sam Gu, Amer Cassier, Sharon Chen, Ron Lindley, Brian Matthew Henderson, S. P. Jeng, Dong Wook Kim, C. H. Yu, Vidhya Ramachandran, C. H. Wu, Riko Radojcic
Publikováno v:
International Symposium on Microelectronics. 2013:000442-000446
We report on a 28nm product prototype test vehicle assembled back-to-face with a 4Gb 3× nm Wide I/O DRAM chip using Through Si Stacking (TSS) technology. The high bandwidth interface of the digital chip to the wide I/O memory chip is enabled by ∼1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::650f19b9266df7cd7ba70317e3a4e73b
https://doi.org/10.4071/isom-2013-wa13
https://doi.org/10.4071/isom-2013-wa13
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In system level electromigration test of 2.5D IC, Joule heating enhanced electromigration failure has been found to occur in redistribution layer in the interposer. In our test samples, there are two redistribution layers (RDL), each between every tw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::851c818e83bebfd67eaf6245667281ee
https://doi.org/10.1109/ectc.2016.212
https://doi.org/10.1109/ectc.2016.212
Publikováno v:
2016 IEEE International Reliability Physics Symposium (IRPS).
This paper investigates the thermal cross-talk between the powered microbumps under one chip and the un-powered microbumps under the neighboring chip. Both chips were on a Si interposer for 2.5D IC. The Joule heating from the powered chip was found t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3fe5ea2c65667c864dceb516d98aa79
https://doi.org/10.1109/irps.2016.7574627
https://doi.org/10.1109/irps.2016.7574627