Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Sallie Hose"'
Autor:
Ton Pinili, Manny Ramos, Ginbert Manalo, Guy Brizar, Koen Matthijs, Frederik Colle, Johan DeGreve, Petr Kocourek, Bill Cowell, John Jensen, John McGlone, Sallie Hose, Jeff Gambino
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Physical and Electrical Characterization of Deep Trench Isolation in Bulk Silicon and SOI Substrates
Autor:
Sallie Hose, Lahcen Boukhanfra, Lan Su, Masaichi Eda, Rick Jerome, Weize Chen, Jaroslav Pjencak, Thomas F. Long, Johan Janssens, Moshe Agam, Kenn Bates
Publikováno v:
2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In this paper the authors present case studies for physical and electrical characterization of Deep Trench Isolation (DTI) in bulk silicon and SOI substrates. For bulk silicon, experimental results demonstrate how the effectiveness of the isolation i
Autor:
D. Price, Dustin Z. Austin, John F. Conley, Sallie Hose, Derryl Allman, Melanie A. Jenkins, Charles L. Dezelah
Publikováno v:
Chemistry of Materials. 29:1107-1115
Atomic layer deposition (ALD) processes are reported for ruthenium (Ru) and ruthenium oxide (RuO2) using a zero-oxidation state liquid precursor, η4-2,3-dimethylbutadiene ruthenium tricarbonyl [Ru(DMBD)(CO)3]. Both ALD Ru and RuO2 films were deposit
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Methods for detecting contamination with native transistor probes are reviewed. This review is based on experience which was accumulated during development of multilevel epitaxial (EPI) high voltage DMOS process technologies including Deep Trench Iso
Autor:
R. Takada, J.P. Gambino, Oli Whear, Santosh Menon, Y. Kanuma, M. Lu, D. Daniel, Y. Watanabe, A. Suhwanov, J. Guo, D. Price, G. Piatt, B. Greenwood, Sallie Hose, Lieyi Sheng
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Two unique gate oxide failure mechanisms are associated with deep trench processes for a 0.18 μm power semiconductor device. One failure mode is a “mini-LOCOS” defect, that is due to inadvertent oxidation of Si in the active area during deep tre
Autor:
Dustin Z. Austin, Sallie Hose, Melanie A. Jenkins, John F. Conley, David J. Price, Derryl Allman, Charles L. Dezelah
Publikováno v:
Chemistry of Materials. 30:8983-8984
Publikováno v:
IEEE Electron Device Letters. 36:496-498
Metal–insulator–insulator–metal (MIIM) capacitors with bilayers of Al2O3 and SiO2 are deposited at 200 °C via plasma enhanced atomic layer deposition. Employing the cancelling effect between the positive quadratic voltage coefficient of capaci
Autor:
Sallie Hose, D. Price, J.P. Gambino, Y. Kanuma, Agajan Suwhanov, Y. Watanabe, B. Greenwood, Oli Whear
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
X-Ray Diffraction Imaging (XRDI) is used to non-destructively image strain in Si associated with deep trench isolation in high voltage devices. The XRD images show that there is dark contrast associated with deep trenches which is indicative of strai
Autor:
Thierry Coffi Herve Yao, Yutaka Ota, Agajan Suwhanov, Tracy Myers, Sallie Hose, Matt Comard, Moshe Agam
Publikováno v:
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).
This paper presents the challenges of integrating 70V and 45V lateral DMOS transistor modules into a 0.18um base line process. This integration is achieved with minimal impact on baseline process and circuit IP's. Multi-epitaxial stack and Deep Trenc
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 32:01A113
Bismuth oxide thin films were deposited by atomic layer deposition using Bi(OCMe2iPr)3 and H2O at deposition temperatures between 90 and 270 °C on Si3N4, TaN, and TiN substrates. Films were analyzed using spectroscopic ellipsometry, x-ray diffractio