Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Saleh Ferwana"'
Autor:
Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili Yu
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 776-783 (2019)
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Externí odkaz:
https://doaj.org/article/bb64a3b25bfb4cc39bd5683382dd2bc9
Autor:
Mohammed Alomari, Alessandro Ottaviani, Joachim N. Burghartz, Thomas Deuble, Christine Harendt, Bjorn Albrecht, Saleh Ferwana, Mourad Elsobky
Publikováno v:
IEEE Sensors Journal. 20:7595-7604
The characterization of multiple mechanically flexible passive and active electronic components, namely on-foil temperature sensor, relative humidity sensor, and ultra-thin microcontroller unit (MCU) integrated circuit (IC) is presented. These compon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::684d9821477832087bbf1b5e33ebf248
https://doi.org/10.1109/jsen.2020.2978550
https://doi.org/10.1109/jsen.2020.2978550
Autor:
Saleh Ferwana, Harald Richter, Zili Yu, Christine Harendt, Bjorn Albrecht, Golzar Alavi, Yigit Mahsereci, Joachim N. Burghartz, Thomas Deuble, Mourad Elsobky
Publikováno v:
IEEE Journal of the Electron Devices Society. 7:776-783
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfde84c468f42405151c2e598eb45602
https://doi.org/10.1109/jeds.2019.2896188
https://doi.org/10.1109/jeds.2019.2896188
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Current electronic systems and circuits possess approximately 80 % of passive components. Thus, high performance integrated silicon-based passive components with high density are required to reduce the overall cost and bulkiness of the systems. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcd76a238e3b92bfe7c574e313249e36
https://doi.org/10.23919/empc44848.2019.8951886
https://doi.org/10.23919/empc44848.2019.8951886
Autor:
Harald Richter, Mourad Elsobky, Saleh Ferwana, Thomad Deuble, Golzar Alavi, Yigit Mahsereci, Joachim N. Burghartz, Christine Harendt, Zili Yu, Bjorn Albrecht
Publikováno v:
2018 International Flexible Electronics Technology Conference (IFETC).
This paper reports on the status of a comprehensive ten-year research and development effort towards Hybrid System-in-Foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::030d11f0963051f034a6806d13b05e78
https://doi.org/10.1109/ifetc.2018.8583909
https://doi.org/10.1109/ifetc.2018.8583909
Autor:
Mazen Saleh Ferwana
Publikováno v:
World Family Medicine Journal/Middle East Journal of Family Medicine. 11:23-32
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::746972214efe06787aeacae3324fb47a
https://doi.org/10.5742/mefm.2014.92434
https://doi.org/10.5742/mefm.2014.92434
Publikováno v:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
Ultrathin chip fabrication is an enabler of high-performance hybrid systems-in-foil (HySiF) for flexible electronics as well as 3D IC's. Minimum chip thickness, exact thickness control, uniformity and reproducibility as well as smoothness of chip sur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32b5dd29dd3b12a2416236c86dc9f486
https://doi.org/10.1109/s3s.2015.7333530
https://doi.org/10.1109/s3s.2015.7333530
Autor:
Harald Richter, Mahadi-Ul Hassan, Horst Rempp, Wolfgang Appel, Joachim N. Burghartz, Stefan Endler, Saleh Ferwana, Evangelos A. Angelopoulos, Christine Harendt, Martin Zimmermann
Publikováno v:
28th Symposium on Microelectronics Technology and Devices (SBMicro 2013).
Various aspects of ultra-thin chip technology for flexible electronics are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding. A stress sensor based on a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cea8b3f93d43f5464f53042d10606671
https://doi.org/10.1109/sbmicro.2013.6676182
https://doi.org/10.1109/sbmicro.2013.6676182
Autor:
Christine Harendt, Saleh Ferwana, Stefan Endler, Evangelos A. Angelopoulos, Joachim N. Burghartz
Publikováno v:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).
Here, we present a flexible sensor based on a stack of two ultra-thin IC-chips, exploiting the excellent chip thickness control in Chipfilm™ technology. The sensor consists of an almost stress-compensated bottom chip and a stress-sensitive top chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::316a8ea010d6f29298ca3384dedc672d
https://doi.org/10.1109/transducers.2013.6627345
https://doi.org/10.1109/transducers.2013.6627345
Autor:
Harald Richter, Joachim N. Burghartz, Horst Rempp, Wolfgang Appel, Mahadi-Ul Hassan, Christine Harendt, Evangelos A. Angelopoulos, Saleh Ferwana, Stefan Endler, Martin Zimmermann
Publikováno v:
2013 IEEE International Conference of Electron Devices and Solid-state Circuits.
Various aspects of ultra-thin chip technology for flexible electronics based on Chipfilm™ technology are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedd
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::807f1262e8646ba9dbce81e207ed678c
https://doi.org/10.1109/edssc.2013.6628168
https://doi.org/10.1109/edssc.2013.6628168