Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sakulkaew Srisang"'
Publikováno v:
KKU Engineering Journal, Vol 42, Iss 1, Pp 61-69 (2015)
The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of fl
Externí odkaz:
https://doaj.org/article/499c670bcfa14aad930d43d1d453f0fc
Publikováno v:
KKU Engineering Journal, Vol 41, Iss 3, Pp 347-355 (2014)
The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of fl
Externí odkaz:
https://doaj.org/article/4e58a28a8e40442a999f0cf0d6457d0f