Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sai Siddhartha Vemula"'
Autor:
Zhengdi Wang, Yitong Zhou, Sai Siddhartha Vemula, Soheil Soghrati, Marcelo J. Dapino, Hossein Qarib, Kushal Gargesh, Ehsan Taghipour, Leon M. Headings
Publikováno v:
International Journal of Mechanical Sciences. 140:211-227
A reduced-order finite element (FE) model is introduced for modeling the mechanical behavior of taped electrical wire bundles subject to bending loads, which can be used for digital manufacturing applications. We show that incorporating the plastic b
Autor:
Sai Siddhartha Vemula, Kushal Gargesh, Leon M. Headings, Mingshi Ji, Soheil Soghrati, Marcelo J. Dapino
Publikováno v:
International Journal of Mechanical Sciences. 170:105355
An analytical model is presented to calculate the elasto-plastic bending response of electrical wires subjected to large deflections. Electrical wires are defined as helically wound conductors enclosed in polymer insulation. For modeling purposes, th
Autor:
Sai Siddhartha Vemula, Marcelo J. Dapino, Ehsan Taghipour, Leon M. Headings, Kushal Gargesh, Soheil Soghrati
Publikováno v:
International Journal of Mechanical Sciences. 165:105188
High-fidelity and reduced-order finite element (FE) models are introduced to simulate and characterize the bending behavior of flexible electrical wire harnesses undergoing large deflections. A composite wire harness consists of a bundle of wires, pu