Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sagir Al Mahmud"'
Autor:
Jeffrey C. Suhling, Md. Sagir Al Mahmud Jony, Pritom Bose, Md. Faiyaz Jamil, Mohammad Motalab
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Lead-free Sn-Ag-Cu materials otherwise known as SAC materials are widely used in the electronic packaging industry for its nontoxic nature unlike Sn-Pb solder materials. Electronics in the present world is shrinking components sizes more rapidly than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::044afdb611fe17acb8241c16ac48868f
https://doi.org/10.1109/itherm51669.2021.9503169
https://doi.org/10.1109/itherm51669.2021.9503169
