Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Safdar Abbas Malik"'
Publikováno v:
Data in Brief, Vol 15, Iss , Pp 97-101 (2017)
The data presented in this article are related to the research article entitled: âSolder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodesâ (Malik et al., 2017) [1]. This article p
Externí odkaz:
https://doaj.org/article/bc7c117b43a04826b1a047528b9b108d
Publikováno v:
Materials Today: Proceedings. 8:625-631
ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 °C). To obtain high performance, these devices require stable and low resistan
Publikováno v:
Materials Today Energy. 5:305-311
Quality of joining and interfacial evolution behavior play a critical role in the performance and reliability of thermoelectric (TE) devices. In this study, different joining methods using Z n − 2 A l solder alloy (1) and solder-free joining with m
Autor:
Safdar Abbas Malik, Ruchi Bhardwaj, B.S. Nagaraja, Riya Thomas, Shyam Prasad K, Nagendra S. Chauhan, Ashok Rao, Benedict Christopher, Ngo Van Nong
Publikováno v:
Prasad K, S, Rao, A, Christopher, B, Bhardwaj, R, Chauhan, N S, Malik, S A, Van Nong, N, Nagaraja, B S & Thomas, R 2018, ' Tuning the thermoelectric properties by manipulating copper in Cu 2 SnSe 3 system ', Journal of Alloys and Compounds, vol. 748, pp. 273-280 . https://doi.org/10.1016/j.jallcom.2018.03.136
Cu2+xSnSe3 (0 ≤ x ≤ 0.08) compounds were synthesized by conventional solid-state reaction followed by spark plasma sintering (SPS) technique. Transport properties of the samples were measured as a function of temperature in the temperature range
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dd9d4ff64905f19ed181e83ef7c41c73
https://orbit.dtu.dk/en/publications/02594129-ee77-49a1-81a9-bd769239d869
https://orbit.dtu.dk/en/publications/02594129-ee77-49a1-81a9-bd769239d869