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Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Vapor chambers and heat pipes are often used as standalone heat spreaders for electronics cooling and in other applications. Metal additive manufacturing (AM) techniques have an intrinsic ability to form the porous structures and internal cavities re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b178d70f063536e968769e930da599a2
https://doi.org/10.1109/itherm.2019.8757359
https://doi.org/10.1109/itherm.2019.8757359
