Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sadayuki Ohnishi"'
Autor:
Hiroyasu Minda, Michio Sakurai, Sadayuki Ohnishi, Hideo Sakamoto, Noriaki Oda, Kenta Yamada, Norio Okada, Manabu Iguchi, Hiroshi Kitahara, Makoto Yasuda, Toshiyuki Takewaki, Masayuki Hiroi, Yoshihiko Asai, M. Suzuki
Publikováno v:
IEICE Transactions on Electronics. :968-977
This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, inco
Autor:
Noriaki Oda, Sadayuki Ohnishi, Kenta Yamada, Kazuyoshi Ueno, Y. Kakuhara, Masayoshi Tagami, Shuji Sone, Hiroyuki Kunishima, Yoshihiro Hayashi, Hironori Imura, M. Sekine, Naoyoshi Kawahara
Publikováno v:
IEICE Transactions on Electronics. :848-855
A novel interconnect design concept named "ASIS (Appilication-specific Interconnect Structure)" is presented for 45 nm CMOS performance maximization. Basic scheme of ASIS is that corresponding to applications, such as high-performance, low-power, or
Autor:
Kenta Yamada, M. Sekine, Noriaki Oda, Naoyoshi Kawahara, H. Imura, Y. Kakuhara, Kazuyoshi Ueno, Hiroyuki Kunishima, Sadayuki Ohnishi, M. Tagami, Yoshihiro Hayashi, S. Sone
Publikováno v:
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
A novel interconnect design concept named "ASIS (application-specific interconnect structure)" is presented for 45 nm CMOS performance maximization. Basic scheme of ASIS is that corresponding to applications, such as high-performance, low-power or hi