Zobrazeno 1 - 2
of 2
pro vyhledávání: '"SS Kang Sungsig"'
Autor:
Zhang Rui Fen, Lim Chze Min Jason, Yam Lip Huei, Balasubramanian Senthil Kumar, Sarangapani Murali, Zhang Han Wen, SS Kang Sungsig, Chan Li-San
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcbfe379c48b310dfa90316199719333
https://doi.org/10.1109/eptc56328.2022.10013151
https://doi.org/10.1109/eptc56328.2022.10013151
Autor:
Chieng Yu Yuan, Sarangapani Murali, Lo Miew Wan, SS Kang Sungsig, Lim Yee Weon Evonne, Ang Kwang Leong Dennis
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Pressure-less Ag-sinter die attach materials are characterized in the present study using test samples processed to a thickness from 20 to $240\mu \mathrm{m}$ by stencil printing and sintering at 200°C for 1h. For test samples to a thickness from $2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f318a244a9813c421f527192735bbf97
https://doi.org/10.1109/ectc32696.2021.00343
https://doi.org/10.1109/ectc32696.2021.00343