Zobrazeno 1 - 10
of 513
pro vyhledávání: '"SIP test"'
Autor:
Witte, Erik1,2 erik.witte@oru.se, Köbler, Susanne2, Ekeroot, Jonas3,4, Smeds, Karolina5, Mäki-Torkko, Elina1,6
Publikováno v:
International Journal of Audiology. Nov2024, Vol. 63 Issue 11, p859-866. 8p.
Akademický článek
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Autor:
Saridou, Elpida
Background: The difficulties for people to understand and perceive speech in second languages in the presence of background noise is well documented in the literature. Similar difficulties have been reported in bilinguals. Consequently, the speech-in
Externí odkaz:
http://urn.kb.se/resolve?urn=urn:nbn:se:oru:diva-106115
Autor:
Witte, Erik
In the current thesis, a Swedish phoneme-level speech-audiometric test in natural background noise was developed. The test is called the Situated Phoneme (SiP) test. In the first study, different types of word metrics thought to influence lexical acc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::c1218a722330d30060b556517e110e9a
http://urn.kb.se/resolve?urn=urn:nbn:se:oru:diva-87871
http://urn.kb.se/resolve?urn=urn:nbn:se:oru:diva-87871
Autor:
Malmberg, Milijana, Witte, Erik
Sound recordings of the NL-normalized test words with masker sounds for the Swedish Situated Phoneme (SiP) test
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99e4bdcb3f1fbf4bcc3efcaa18198d23
Autor:
Witte, Erik, Malmberg, Milijana
Sound recordings of the test words for the Swedish Situated Phoneme (SiP) test
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0f182bdf49d39868e7651b2d256ec93
Autor:
Jarrett, Vicky
Publikováno v:
Furniture Today. 11/6/2023, Vol. 48 Issue 8, p14-14. 1/4p.
Autor:
Osborne, Sonya, Gardner, Glenn, Gardner, Anne, Franklin, Susan, Touhy, Elizabeth, Fisher, Alex
Publikováno v:
AORN Journal; Apr2006, Vol. 83 Issue 4, p908-928, 16p
Publikováno v:
Nordic Journal of Linguistics (Cambridge University Press); May2024, Vol. 47 Issue 1, p73-110, 38p
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
A SiP(System in Package) consists of multiple chips stacked and connected within a package. And SiP testing is a significant and growing problem owing to the limited accessibility and its particular test flow. It requires individual chip-level, inter