Zobrazeno 1 - 9
of 9
pro vyhledávání: '"SHUMYACHER, Vyacheslav"'
Autor:
LI, Benkai, DAI, Chenwei, DING, Wenfeng, YANG, Changyong, LI, Changhe, KULIK, Olga, SHUMYACHER, Vyacheslav
Publikováno v:
In Chinese Journal of Aeronautics August 2021 34(8):65-74
Autor:
Lubimyi, Nickolai, Voronenko, Vladimir Pavlovich, Polshin, Andrey, Gerasimov, Mihail, Sergey, Antsiferov, Öztürk, Oğuz Kaan, Chetverikov, Boris, Tikhonov, Alexander, Ryazantsev, Vladislav, Mikhailovich, Shumyacher Vyacheslav, Nikita, Melentiev
Publikováno v:
Australian Journal of Mechanical Engineering; Apr2024, Vol. 22 Issue 2, p314-325, 12p
Autor:
Nickolai Lubimyi, Vladimir Pavlovich Voronenko, Andrey Polshin, Mihail Gerasimov, Antsiferov Sergey, Oğuz Kaan Öztürk, Boris Chetverikov, Alexander Tikhonov, Vladislav Ryazantsev, Shumyacher Vyacheslav Mikhailovich, Melentiev Nikita
Publikováno v:
Australian Journal of Mechanical Engineering. :1-12
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d5b7cd25e86e3ac2142841d1ba38d9a
https://doi.org/10.1080/14484846.2022.2094533
https://doi.org/10.1080/14484846.2022.2094533
Publikováno v:
MATEC Web of Conferences, Vol 297, p 09003 (2019)
A physical description of material grindability is proposed as a property of deformation and surface destruction of processed surface at the envelope removal. A mechanism for microchip formation is described, which consists in changing mobility of th
Externí odkaz:
https://doaj.org/article/594c0e222e9a4b05881fb957f6019355
Publikováno v:
MATEC Web of Conferences, Vol 297, p 09002 (2019)
The mechanism of chip formation process at grinding is described, which involves a high-speed interaction of abrasive grain and metal, which leads to a concentration of thermal energy in front of the dispersing element (grain), causing a locally conc
Externí odkaz:
https://doaj.org/article/7a2a3967a121492dacd4c4492fbe66bf
Akademický článek
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Publikováno v:
Diffusion and Defect Data Part A: Defect and Diffusion Forum; August 2021, Vol. 410 Issue: 1 p262-268, 7p
Autor:
Vöth, S., Cuong, N.C., Van Hoan, N., Vavrek, R., Panteleenko, F.I., Popek, S., Shumyacher, Vyacheslav, Kryukov, Sergey, Kulik, Olga, Kennedy, Xavier
Publikováno v:
MATEC Web of Conferences; 2019, Vol. 297, p1-6, 6p
Autor:
Vöth, S., Cuong, N.C., Van Hoan, N., Vavrek, R., Panteleenko, F.I., Popek, S., Shumyacher, Vyacheslav, Kryukov, Sergey, Kulik, Olga, Kennedy, Xavier
Publikováno v:
MATEC Web of Conferences; 2019, Vol. 297, p1-5, 5p