Zobrazeno 1 - 10
of 82
pro vyhledávání: '"S.P. Kilcoyne"'
Autor:
M. Haggerott-Crawford, C. R. Abernathy, D. Zhang, R. M. Kolbas, S.P. Kilcoyne, J. M. Zavada, Robert G. Wilson, Randy J. Shul, Stephen J. Pearton, J. D. MacKenzie, J.R. Mileham, Robert N. Schwartz
Publikováno v:
Solid-State Electronics. 41:353-357
Several kinds of nitride-based micro-resonators have been fabricated. Firstly, a microdisk laser structure comprising three InGaN GaN quantum wells on a thick AlN buffer has been grown by metal-organic molecular beam epitaxy and fabricated using a co
Autor:
C. R. Abernathy, S.P. Kilcoyne, M. Hagerott-Crawford, Arnold J. Howard, Randy J. Shul, J.E. Parmeter, Stephen J. Pearton, Catherine Vartuli
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 14:1011-1014
Two broad classes of plasma chemistry were examined for dry etching of GaN, AlN, and InN. The etch rates for CH4/H2‐based plasmas are low (∼ 400 A/min) even under high microwave power (1000 W) electron cyclotron resonance conditions. Halogen‐ba
Autor:
Randy J. Shul, J. D. MacKenzie, S.P. Kilcoyne, Stephen J. Pearton, C. R. Abernathy, Jeffrey Mileham
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 14:836-839
Wet chemical etching of single crystal III–V nitrides has proven difficult in the past due to their excellent stability in corrosive liquids. We have found that KOH‐based solutions provide reaction‐rate limited etching of AlN at rates strongly
Autor:
C. R. Abernathy, Stephen J. Pearton, J.M. Zavada, John C. Zolper, Fan Ren, Robert G. Wilson, M. Hagerott-Crawford, R.G. Schwartz, Randy J. Shul, S.P. Kilcoyne
Publikováno v:
Materials Science and Engineering: B. 38:138-146
Advances in GaN-based electronic and photonic devices requires improved patterning methods, better Ohmic contacts and higher p-type dopong levels. In this paper, new developments in dry and wet etching. Ohmic contacts and epitaxial growth of III–V
Publikováno v:
IEEE Photonics Technology Letters. 6:778-781
We report advances in the power conversion efficiencies of vertical-cavity top-surface-emitting lasers defined by proton implantation. Efficiencies as high as 13.4% and 15.8% have been obtained for single-mode and multimode operation, respectively. S
Autor:
John C. Zolper, Vincent M. Hietala, J.J. Banas, Hong Q. Hou, S.P. Kilcoyne, B. E. Hammons, Kevin L. Lear
Publikováno v:
CLEO '97., Summaries of Papers Presented at the Conference on Lasers and Electro-Optics.
We have previously demonstrated record modulation bandwidths for oxide-confined vertical-cavity surface-emitting lasers (VCSELs) based on strained InGaAs/GaAs quantum wells.1
Autor:
Kevin L. Lear, Jeffrey J. Figiel, J. A. Lott, Kent D. Choquette, Mary H. Crawford, Richard P. Schneider, S.P. Kilcoyne
Publikováno v:
Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics.
Metalorganic vapor phase epitaxy (MOVPE) is used for the growth of vertical-cavity surface-emitting laser (VCSEL) diodes. MOVPE exhibits a number of important advantages over the more commonly-used molecular-beam epitaxial (MBE) techniques, including
Publikováno v:
IEEE Photonics Technology Letters. 8:740-742
Implant and oxide confined vertical-cavity surface-emitting lasers are compared in terms of properties dependent upon the nature of index guiding in the two structures including CW threshold current scaling with size, light-current linearity, pulsed
Autor:
R. M. Kolbas, C. R. Abernathy, J. D. MacKenzie, D. Zhang, S. J. Pearton, J. M. Zavada, Kevin S. Jones, S. Bharatan, J.R. Mileham, V. Krishnamoorthy, M. Hagerott-Crawford, Randy J. Shul, S.P. Kilcoyne
Publikováno v:
Solid-State Electronics. 39:311-313
Autor:
J. D. MacKenzie, Cammy R. Abernathy, Stephen J. Pearton, Jeffrey Mileham, S.P. Kilcoyne, Randy J. Shul
Publikováno v:
Applied Physics Letters. 67:1119-1121
Single‐crystal AlN grown on Al2O3 is found to be wet etched by AZ400K photoresist developer solution, in which the active component is KOH. The etching is thermally activated with an activation energy of 15.5±0.4 kcal mol−1, and the etch rate is