Zobrazeno 1 - 10
of 31
pro vyhledávání: '"S.N. Burchett"'
Publikováno v:
Journal of Electronic Materials. 28:1290-1298
Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::292b0468a30e412c21d2801ebc61bae9
https://doi.org/10.1007/s11664-999-0170-3
https://doi.org/10.1007/s11664-999-0170-3
Publikováno v:
Soldering & Surface Mount Technology. 9:39-42
The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy has a number of processing advantages(suitable melting point of 183°C and good wetting behaviour). However, under co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad7d5e3a01fe7c03c686a32cf225b6e
https://doi.org/10.1108/09540919710800601
https://doi.org/10.1108/09540919710800601
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
We report the first in situ measurements of thermomechanical stresses in a 1000 I/O 250 /spl mu/m pitch piezoresistive flip chip test chip assembled to a 755 I/O 1.0 mm pitch 35 mm Ball Grid Array (BGA). The BGA substrates employed "build-up" dielect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89783430eb08c447f1f86f7e7022796b
https://doi.org/10.1109/ectc.1999.776397
https://doi.org/10.1109/ectc.1999.776397
Autor:
S.N. Burchett, T.D. Hund
Publikováno v:
The Conference Record of the Twenty-Second IEEE Photovoltaic Specialists Conference - 1991.
Solder fatigue tests have been conducted on point focus photovoltaic concentrator cell assemblies to identify a baseline fatigue life and to quantify the fatigue life improvements that result using a copper-molybdenum-copper low-expansion insert betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fb07ba4bb9a8d8604f5c1cc2406e275
https://doi.org/10.1109/pvsc.1991.169310
https://doi.org/10.1109/pvsc.1991.169310
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2315536431eebc2f9077774043e14a44
https://doi.org/10.2172/477670
https://doi.org/10.2172/477670
A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93e657837868a7a32b6e11cc61e7cac2
https://doi.org/10.2172/486148
https://doi.org/10.2172/486148
We report the first measurements of in-situ flip-chip assembly mechanical stresses using a CMOS piezoresistive test chip repatterned with a fine pitch full area array. A special printed circuit board substrate was designed at Sandia and fabricated by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::584f9e8b41a1ab0595fcb5b4e9b7648c
https://doi.org/10.2172/463650
https://doi.org/10.2172/463650
A new viscoplastic theory for CusilABA and other braze alloys has been developed. Like previous viscoplastic theories,this new theory uses a hyperbolic sine function of effective stress in its kinetic equation for the inelastic strain rate. This new
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9262da927760dab9b9bd25312c8a9b0
https://doi.org/10.2172/233338
https://doi.org/10.2172/233338
Publikováno v:
10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention.
We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves the integration of experimental and computational techniques. The first stage involves correlating the manufacturing an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0b14b4762a7d4763da453cb3a296f85
https://doi.org/10.1115/detc1993-0081
https://doi.org/10.1115/detc1993-0081
Autor:
S.N. Burchett, T.R. Guess
A combined experimental and analytical study of strains developed in encapsulated assemblies during casting, curing and thermal excursions is described. The experimental setup, designed to measure in situ strains, consisted of thin, closed-end, Kovar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08682145ab1cc216b9222fd5ac64c67b
https://doi.org/10.2172/6187028
https://doi.org/10.2172/6187028