Zobrazeno 1 - 10
of 45
pro vyhledávání: '"S.M. Sinaga"'
Publikováno v:
RASAYAN Journal of Chemistry. 15:792-797
Dyslipidemia is an important major issue that accounted for atherosclerosis and coronary heart disease. Therapy with synthetic drugs becomes a daily routine and can lead to multiple side effects. This makes herbal medicine often used as an additional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c7978bf0c1170f7b6aecb8fd364325a
https://doi.org/10.31788/rjc.2021.1526265
https://doi.org/10.31788/rjc.2021.1526265
Autor:
Benni S.M Sinaga, Sondang R. Manurung
Publikováno v:
INPAFI (Inovasi Pembelajaran Fisika); Vol 8, No 3 (2020): INPAFI
Penelitian ini bertujuan untuk mengetahui pengaruh model pembelajaran inquiry training terhadap hasil belajar siswa pada materi elastisitas dan hukum hooke di kelas XI semester I SMA Negeri 1 Parbuluan, Dairi T.P 2019/2020. Jenis penelitian ini merup
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4887397302f11e3e9e200e6b8b713ceb
https://jurnal.unimed.ac.id/2012/index.php/inpafi/article/view/19793
https://jurnal.unimed.ac.id/2012/index.php/inpafi/article/view/19793
Publikováno v:
REGISTER Journal of English Language Teaching of FBS-Unimed; Vol 2, No 4 (2013)
This study attempts to improve students’ speaking achievement through think-pair-share technique by conducting action research method. The subject of this study was XI-IPA 1’s students which consisted of 36. This study was conducted in two cycles
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::32c18cfd1a0727954fec5622405473a0
https://doi.org/10.24114/reg.v2i4.843
https://doi.org/10.24114/reg.v2i4.843
Akademický článek
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Akademický článek
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Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Electrical performance of via-connected rectangular spiral inductors integrated on a low-loss spacer substrate and thus vertically-spaced above a lossy silicon substrate is analyzed using 3D electromagnetic simulation tool Ansoft HFSS with a goal to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::204baa2ce8fcd29d3bd2a873ba31e117
https://doi.org/10.1109/ectc.2005.1442001
https://doi.org/10.1109/ectc.2005.1442001
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
The wafer-level chip-scale packaging (WLCSP) concept offers a lot of new possibilities. Not only is the package size smaller, but also features to improve the performance can be easily realized. It is widely known that the radio frequency integrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b7f1d27fc148a80433585b323195e5e
https://doi.org/10.1109/eptc.2004.1396569
https://doi.org/10.1109/eptc.2004.1396569
Publikováno v:
IEEE Electron Device Letters, 26 (8)
Self-heating effects on integrated suspended and bulk spiral inductors are explored. A dc current is fed through the inductors during measurement to emulate dc and radio frequency power loss on the inductor. A considerable drop in Q by /spl sim/18% a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f01aa07b60133e389c4b7a067245eed
http://resolver.tudelft.nl/uuid:7479cc2e-1936-4459-a7e5-c0b4f88f7582
http://resolver.tudelft.nl/uuid:7479cc2e-1936-4459-a7e5-c0b4f88f7582
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
In this work, theoretical and experimental analysis of RF crosstalk suppression by substrate thinning and trenching is performed. Medici (2D solver) simulation results show that high isolation can be achieved by using high resistivity thinned substra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58837a5aae2a4424641e6df907724bfb
https://doi.org/10.1109/ectc.2004.1320316
https://doi.org/10.1109/ectc.2004.1320316
Publikováno v:
CIÊNCIAVITAE
Scopus-Elsevier
Scopus-Elsevier
High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas and RF passive components (e.g. large inductors) in wafer-level chip-scale packages (WLCSP). Sandwiching
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::64251cd6f68365e09ef6518a7e005f35
https://hdl.handle.net/1822/1634
https://hdl.handle.net/1822/1634