Zobrazeno 1 - 10
of 94
pro vyhledávání: '"S.C. O'Mathuna"'
Publikováno v:
IEEE Transactions on Magnetics. 47:4429-4432
What is the future of integrated inductor design on silicon for power conversion applications at frequencies up to 100 MHz-is it magnetic-core or air-core inductors. This study presents measured results for two microfabricated inductors (magnetic cor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75d1ae0af5ca7132903c8ac25fa34abe
https://doi.org/10.1109/tmag.2011.2158519
https://doi.org/10.1109/tmag.2011.2158519
Autor:
Ningning Wang, Santosh Kulkarni, Terence O'Donnell, S.C. O'Mathuna, Fernando M.F. Rhen, Saibal Roy, Ronan Meere
Publikováno v:
Journal of Magnetism and Magnetic Materials. 322:1690-1693
Micro-inductors, with an electrodeposited nickel–iron core have been fabricated on silicon substrates, and have been characterized in the frequency range up to 100 MHz. The core consists of a nickel iron, 45:55 alloy which is deposited using pulse-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f35217dcac791fe2d4449a3d1ed58b9c
https://doi.org/10.1016/j.jmmm.2009.01.038
https://doi.org/10.1016/j.jmmm.2009.01.038
Publikováno v:
IEEE Transactions on Magnetics. 45:4234-4237
This paper presents the design and measurement of optimized inductors-on-silicon (ldquomicro-inductorsrdquo) for use in high frequency DC-DC conversion applications. These ultra-compact low profile (< 70 mum) inductors range in area from 0.5-2.5 mm2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1bd0e48aa0c64def823410f7da74ae8
https://doi.org/10.1109/tmag.2009.2024544
https://doi.org/10.1109/tmag.2009.2024544
Publikováno v:
IEEE Transactions on Power Electronics, 24(9), 2212-2218. Institute of Electrical and Electronics Engineers
This paper presents a low-profile thin-film microfabricated inductor on silicon and its performance in a high-frequency low-power DC/DC converter. The design of the inductors has focused on maximizing efficiency while maintaining a relatively flat fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ffca364372ac088623fa488bfe079a6
https://doi.org/10.1109/TPEL.2009.2021942
https://doi.org/10.1109/TPEL.2009.2021942
Autor:
Ronan Meere, Saibal Roy, Ningning Wang, Terence O'Donnell, Fernando M.F. Rhen, S.C. O'Mathuna
Publikováno v:
IEEE Transactions on Magnetics. 44:4096-4099
This paper presents a microinductor fabricated on silicon using electrochemical techniques that has high efficiency in a low power dc-dc converter. Small signal measurements show a flat frequency response up to 20 MHz with a self resonant frequency o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::770bcc425ce3ec421b58ea948fe9f71f
https://doi.org/10.1109/tmag.2008.2001584
https://doi.org/10.1109/tmag.2008.2001584
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:605-615
The flip chip technique using conductive adhesives have emerged as a good alternative to solder flip chip methods. Different approaches of the interconnection mechanism using conductive adhesives have been developed. In this paper, test chips with go
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3675a1891cc71234aa352a26486eded
https://doi.org/10.1109/tadvp.2007.898639
https://doi.org/10.1109/tadvp.2007.898639
Publikováno v:
Microelectronics International. 24:3-6
PurposeThis paper aims to describe the simulation, design, development and characterisation of antennas for wireless sensor networks operating in a variety of environments, including an under water submarine application and more usual “open air”
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9f184be78cd68a281736ce1859f331e
https://doi.org/10.1108/13565360710745520
https://doi.org/10.1108/13565360710745520
Publikováno v:
Journal of Micromechanics and Microengineering. 16:1519-1529
This paper investigates the effects of thinning on different properties of silicon test die. Silicon test wafers of different thicknesses (525, 250, 100 and 50 µm) were thinned using a mechanical grinding process. The wafers were diced by using a sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46b0e3612d538e5071f7005521a4f872
https://doi.org/10.1088/0960-1317/16/8/012
https://doi.org/10.1088/0960-1317/16/8/012
Publikováno v:
Sensors and Actuators A: Physical. 129:20-24
This paper describes the design and testing of a planar fluxgate current sensor, which is totally embedded in printed circuit board (PCB) and which is suitable for sensing currents in the printed circuit board traces. Fluxgate excitation and pickup c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03af423e7ae04f1f2cadd54434436a59
https://doi.org/10.1016/j.sna.2005.09.044
https://doi.org/10.1016/j.sna.2005.09.044
Publikováno v:
Microelectronics Reliability. 46:896-904
The reliability of the eutectic Sn37Pb (63%Sn37%Pb) and Sn3.5Ag (96.5%Sn3.5%Ag) solder bumps with an under bump metallization (UBM) consisting of an electroless Ni(P) plus a thin layer of Au was evaluated following isothermal aging at 150 °C. All th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e886fb1c33ad4993b374dedbdb8412
https://doi.org/10.1016/j.microrel.2005.06.006
https://doi.org/10.1016/j.microrel.2005.06.006