Zobrazeno 1 - 10
of 32
pro vyhledávání: '"S.A. Gee"'
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:478-484
A reliability problem associated with integrated circuit assembly in molded plastic packages involves cracking in the deposited thin film layers on the top silicon surface. During thermal cycle testing, thermomechanical stresses resulting from differ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7035c4712e0fb81d2544ea8a13ccfab6
https://doi.org/10.1109/96.404105
https://doi.org/10.1109/96.404105
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 18:15-22
When a plastic package is subjected to repeated thermal excursions such as during thermal cycling or thermal shock, progressive damage to the silicon die occurs. Damage can be initiated in the form of interfacial delamination accompanied by passivati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e205967f2d44ed86e0a503495823b712
https://doi.org/10.1109/95.370729
https://doi.org/10.1109/95.370729
Publikováno v:
Proceedings., 39th Electronic Components Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afd08d581fc0d4b51b015f3630217bb5
https://doi.org/10.1109/ecc.1989.77769
https://doi.org/10.1109/ecc.1989.77769
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
In molded DIP packaging die attach stresses and stresses due to the contraction of the molding compound lead to a complex state of stress on the die surface where active device elements are located. This paper summarizes experimentation to reduce the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10e28ca95834f0e1ca1cd41e8f0fa489
https://doi.org/10.1109/ectc.1993.346764
https://doi.org/10.1109/ectc.1993.346764
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
This study attempts to elucidate the interaction of three main material components in a plastic package: mold compound, die attach, and die coating. The investigation was divided into three parts, addressing the combined effect of the previous three
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e84343c055d385451f850f1ddcc463ce
https://doi.org/10.1109/ectc.1993.346774
https://doi.org/10.1109/ectc.1993.346774
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5119035ea2461d894a301a705d01bf4d
https://doi.org/10.1109/ectc.1994.367499
https://doi.org/10.1109/ectc.1994.367499
Publikováno v:
Proceedings of the IEEE International Conference on Microelectronic Test Structures; 1988, p185-191, 7p
Publikováno v:
MRS Proceedings. 4
A characterization of Q-switched Nd-YAG laser induced backside damage in various stages of a bipolar process is presented. TEM-analysis shows the occurence of microcracks, low angle boundaries and dislocations in as-irradiated wafers, of which the mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0993d1602bf245f660e8d8a0031039ae
https://doi.org/10.1557/proc-4-615
https://doi.org/10.1557/proc-4-615
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