Zobrazeno 1 - 10
of 27
pro vyhledávání: '"S. W. Bedell"'
Publikováno v:
AIP Advances, Vol 9, Iss 3, Pp 030701-030701-12 (2019)
Silicon based complementary metal-oxide-semiconductor field-effect-transistor (CMOSFET) technology has continued to progress unabated for last five decades despite various challenges arising due to extreme scaling. Pervasive use of Si technology is e
Externí odkaz:
https://doaj.org/article/41d44353d20c4e49a94c482a47b481b2
Publikováno v:
Solid-State Electronics. 117:117-122
In this work, we demonstrate mechanically flexible extremely thin silicon on insulator (ETSOI) ring oscillators with a stage delay of ∼16 ps at a power supply voltage of 0.9 V. Extensive electrical analyses of the flexible ETSOI devices reveal the
Autor:
Christos D. Dimitrakopoulos, Cheng-Wei Cheng, Hongsik Park, Jeehwan Kim, Kathleen B. Reuter, D. K. Sadana, Can Bayram, John A. Ott, S. W. Bedell
Publikováno v:
2017 IEEE Photonics Conference (IPC).
Fully functional thin-film blue LED was fabricated by novel means of (1) performing epitaxial growth of a single crystalline InGaN/GaN heterostructure on a recycled graphene/SiC substrate (2) followed by release and transfer of the heterostructure.
Autor:
S. W. Bedell, Bahman Hekmatshoar, Davood Shahrjerdi, Devendra K. Sadana, John A. Ott, Marinus Hopstaken
Publikováno v:
ECS Transactions. 45:31-37
We present a unique ultra low-temperature plasma enhanced chemical vapor deposition process that enables epitaxial growth of compressively strained silicon directly on silicon substrates. The epitaxial layers were structurally examined using high-res
Autor:
D. K. Sadana, S. W. Bedell, K. Fogel, Nicolas Daval, Ali Khakifirooz, Anthony G. Domenicucci, Pranita Kulkarni
Publikováno v:
Microelectronic Engineering. 88:324-330
A thin body (fully depleted) strained SGOI device structure (FDSGOI), and a strained SiGe channel layer on SOI, were fabricated using scaled [email protected] gate dielectrics and metal gate technology. The uniaxial strain effect and corresponding dr
Publikováno v:
Journal of Crystal Growth. 316:101-105
A commercially available 300 mm single-wafer UHV-CVD reactor was used to grow strained pseudomorphic Si 0.79 Ge 0.21 layers beyond the critical thickness on Si substrates. A unique in situ method of introducing controlled amounts of oxygen at the gro
Autor:
S.R. Shinde, D. K. Sadana, T. Seino, T. Tsunoda, Alexander Reznicek, S. W. Bedell, J. Nakatsuru, A. Venkateshan, Thomas N. Adam
Publikováno v:
Journal of Crystal Growth. 312:3473-3478
Epitaxial (1 0 0) silicon layers were grown at temperatures ranging from 500 to 800 °C in a commercial cold-wall type UHV/CVD reactor at pressures less than 7×10 −5 Torr. The substrates were 300 mm SIMOX SOI wafers and spectroscopic ellipsometry
Publikováno v:
Materials Science in Semiconductor Processing. 9:423-436
One of the main challenges to creating a GeOI-based FET is simply to create a high-quality single-crystal layer for the channel material. Due to the low cost and wide availability of Si substrates, the most popular approach to Ge FET material develop
Autor:
M. Guillorn, Jeffrey W. Sleight, Jemima Gonsalves, Christian Lavoie, Sebastian Engelmann, Siyuranga O. Koswatta, Fei Liu, Zhen Zhang, J. Newbury, Ashish Baraskar, Paul M. Solomon, A. Pyzyna, Yu Zhu, Wei Song, Cyril Cabral, S. W. Bedell, Michael F. Lofaro, Marinus Hopstaken, Li Yang, Mark Raymond, Kenneth P. Rodbell, Ahmet S. Ozcan, C. Witt
Publikováno v:
IEEE Electron Device Letters. 34:723-725
Contact resistances are directly measured for contacts with sizes from 25 to 330 nm using e-beam based nano-TLM devices. Record low contact resistivities ~1.5 × 10-9 Ω· cm2 are extracted from Ni(Pt) silicide contacts on in situ boron-doped Si0.7Ge
Publikováno v:
ECS Solid State Letters. 2:N8-N10