Zobrazeno 1 - 10
of 107
pro vyhledávání: '"S. Voges"'
Publikováno v:
Journal of Communication Management. 27:64-83
PurposeThe purpose of the study is to provide insights on the COVID-19 pandemic communication from the lessons learned by health communication executives—how they perceived the COVID-19 pandemic and recommend preparing for communication management
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d2148d71b6e19898ef0ef9b9b78dc9a
https://doi.org/10.1108/jcom-12-2021-0137
https://doi.org/10.1108/jcom-12-2021-0137
Autor:
K.-F. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow
Publikováno v:
International Symposium on Microelectronics. 2021:000021-000025
Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d61f8fa3baf923223f1a082a473689d2
https://doi.org/10.4071/1085-8024-2021.1
https://doi.org/10.4071/1085-8024-2021.1
Akademický článek
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Autor:
Matthew T Binford, Taylor S Voges
Publikováno v:
Journal of International Crisis and Risk Communication Research, Vol 4, Iss 2, Pp 221-246 (2021)
The COVID-19 pandemic presents a unique environment from which each individual state, in the United States, has been forced to address their publics. In order to understand how each state has engaged with this pandemic, a textual analysis of each sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::97465d3be5d02acd6f794b44d135aa2d
https://stars.library.ucf.edu/jicrcr/vol4/iss2/3/
https://stars.library.ucf.edu/jicrcr/vol4/iss2/3/
Autor:
S. Voges, C. McDermott
Publikováno v:
Chemie Ingenieur Technik. 94:1320-1320
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f81d7f9b6dc7d58878c37423ff6ab9c
https://doi.org/10.1002/cite.202255323
https://doi.org/10.1002/cite.202255323
Publikováno v:
Public Relations Review. 48:102141
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38d35cab43aa5ef04ad619586599f756
https://doi.org/10.1016/j.pubrev.2021.102141
https://doi.org/10.1016/j.pubrev.2021.102141
Autor:
Martin Schneider-Ramelow, V. Bader, Gerd Jungmann, S. Voges, Jeremias Pauls, Karl-Friedrich Becker, Tanja Braun, Mathias Minkus, Hubert Wieser, K-D. Lang
Publikováno v:
International Symposium on Microelectronics. 2017:000182-000187
The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831fa1e1084a2cd230786883d4488bf4
https://doi.org/10.4071/isom-2017-wa15_077
https://doi.org/10.4071/isom-2017-wa15_077
Autor:
L. Boettcher, K-D. Lang, L. Stobbe, O. Hoelck, S. Voges, Martin Schneider-Ramelow, Tanja Braun, M. Toepper, Rolf Aschenbrenner, K.-F. Becker, M. Woehrmann
Publikováno v:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46750abff767f57ffeea3547c9d0fc67
https://doi.org/10.23919/ltb-3d.2019.8735124
https://doi.org/10.23919/ltb-3d.2019.8735124
Autor:
Karl-Friedrich Becker, R. Kahle, S. Raatz, James M. Bauer, S. Voges, Mathias Minkus, Tanja Braun, Leopold Georgi, V. Bader, K-D. Lang, Markus Wohrmann, R. Aschenbrenner
Publikováno v:
International Symposium on Microelectronics. 2016:S1-S23
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98e692b0fc6931ae24dc0b428a2e8970
https://doi.org/10.4071/isom-2016-slide-4
https://doi.org/10.4071/isom-2016-slide-4
Autor:
Tanja Braun, K-D. Lang, R. Kahle, S. Voges, K.-F. Becker, Martin Schneider-Ramelow, T. Thomas, M. Koch, S. Raatz, M. Fliess, J. Bauer
Publikováno v:
International Symposium on Microelectronics. 2016:000345-000350
Today's microelectronics packaging especially for SiPs relies on the processing of a wide variety of materials Such as materials for components, substrates, contact materials (solder & adhesives) and encapsulants. Most materials are processed as bulk
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::21db472cc297a61d95b180410f3d6a71
https://doi.org/10.4071/isom-2016-wp45
https://doi.org/10.4071/isom-2016-wp45