Zobrazeno 1 - 10
of 94
pro vyhledávání: '"S. Vicknesh"'
Publikováno v:
2019 Electron Devices Technology and Manufacturing Conference (EDTM).
We have investigated the DC and RF performances of AlGaN/GaN HEMTs on CVD-Diamond at high power density continuous wave (CW) operating condition. About 4-times improved DC and RF performances were observed in GaN/Dia HEMTs, which was due to the lower
Publikováno v:
physica status solidi c. 10:1421-1425
We have studied the drain current dispersion characteristics of conventional AlGaN/GaN HEMTs and SiN/Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMT) fabricated on silicon substrate. The fabricated MISHEMT ex
Autor:
R. Grover, Soo Jin Chua, S. R. Shannigrahi, J. N. Tan, S. A. Oh, Sukant K. Tripathy, Bhupendra Kumar, Lianshan Wang, S. Vicknesh, A. Ramam, J. Arokiaraj, K. Y. Zang, Hao Gong, Vivian Kaixin Lin
Publikováno v:
physica status solidi (a). 205:1168-1172
Using a combination of selective dry etching techniques, surface micro-machined GaN and ZnO micromechanical structures are demonstrated on silicon-on-insulator (SOI) substrates. The dry releasing technique employs a controlled gas phase pulse etching
Publikováno v:
Microsystem Technologies. 14:331-341
A novel InP-based microactuator, which is actuated by electrostatic means, has been proposed, designed, fabricated, and characterized for tuning applications in the 1.5 μm wavelength domains. Its structural design is based on the global optimization
Publikováno v:
Applied Surface Science. 253:1243-1246
Using a low-temperature wafer bonding process, InP substrates are bonded to silicon-on-insulator (SOI) substrates at 220 °C. A combination of oxygen plasma and chemical treatment results in a direct contact bonding at room temperature. After the bon
Publikováno v:
Journal of Physics: Conference Series. 34:404-409
Wafer bonding or wafer fusion is a method of combining two same or dissimilar materials, either atomically or by means of adhesive. In this paper we report a new process to bond thin film Indium Phosphide (InP) to oxidized Silicon (100) substrates at
Publikováno v:
Electrochemical and Solid-State Letters. 8:G115-G118
Publikováno v:
IEEE Electron Device Letters. 34:1364-1366
Enhanced OFF -state breakdown voltage has been observed in ammonium sulfide [(NH4)2Sx]-treated AlGaN/GaN high electron mobility transistors (HEMTs) on Si substrate without compromising the unit gain cutoff frequencies. About six times higher OFF -sta
Autor:
A. Ramam, S. Vicknesh
Publikováno v:
Journal of The Electrochemical Society. 151:C772-C780
A systematic study of the etching of InP material by hydrogen bromide (HBr)-based chemistry is conducted using the inductively coupled plasma (ICP) technique. Sidewall profiles, material selectivity, surface morphologies, and the residual species due
Autor:
Binit Syamal, C. M. Manoj Kumar, K. Ranjan, Geok Ing Ng, S. C. Foo, M. J. Anand, S. Vicknesh, Xing Zhou, Subramaniam Arulkumaran
The influence of electric field (EF) on the dynamic ON-resistance (dyn-R DS[ON]) and threshold-voltage shift (ΔVth) of AlGaN/GaN high electron mobility transistors on Si has been investigated using pulsed current-voltage (IDS-VDS) and drain current
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b78cd2df57d0fc76e15801fa3d95bd5a
http://hdl.handle.net/10220/25288
http://hdl.handle.net/10220/25288