Zobrazeno 1 - 3
of 3
pro vyhledávání: '"S. Venkateshwara Sharma"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1015-1020
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d51fefa63f15305c317c6d8b4cb1be1
https://doi.org/10.1109/tcpmt.2022.3176672
https://doi.org/10.1109/tcpmt.2022.3176672
Publikováno v:
ICTACT Journal on Microelectronics, Vol 5, Iss 1, Pp 744-749 (2019)
Trend in electronic packaging towards reduction in the dimension of conductive tracks in printed wiring boards continues, adhesion at the interface between the laminated copper and the electroplated copper becoming critical issues. In order to improv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doajarticles::fecccc2eb979bcbb8e6d1b6477e73dc8
http://ictactjournals.in/paper/IJME_Vol_5_Iss_1_Paper_7_744_749.pdf
http://ictactjournals.in/paper/IJME_Vol_5_Iss_1_Paper_7_744_749.pdf
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:131-137
Microwave substrates such as glass-reinforced polytetrafluoroethylene (PTFE) are well known for high-speed signal applications due to their inherent properties of low dielectric loss and stable dielectric constant over wide range of frequencies. Howe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bab7bde1dd449a903a7640269d0080c2
https://doi.org/10.1109/tcpmt.2016.2624760
https://doi.org/10.1109/tcpmt.2016.2624760