Zobrazeno 1 - 10
of 16
pro vyhledávání: '"S. T. Chua"'
Publikováno v:
Clinical Colorectal Cancer. 21:e179-e186
Publikováno v:
Melanoma research. 32(3)
Melanoma remains a large global burden with a significant proportion of patients succumbing to metastatic disease. The adrenal gland is a common area for metastasis with surgical treatment as the main modality. Radiotherapy is less utilised in this s
Autor:
Kim Shyong Siow, S. T. Chua
Publikováno v:
Metals and Materials International. 26:1404-1414
The sintered silver (Ag) joint has proven to be a suitable die-attach material to be used under the operating conditions of wide bandgap semiconductors because of its high melting point and high thermal and electrical conductivities. However, to bond
Autor:
Kim Shyong Siow, S. T. Chua
Publikováno v:
JOM. 71:3066-3075
Sintered silver is a promising die-attach material capable of operating at temperatures of more than 200°C. However, while sintering reliably bonds Ag paste on Ag-plated substrate, reliability studies are needed to understand the behavior of this si
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:6212-6223
Sintered silver joint has been reported as the front-runner for Pb-free die attach joints for high temperature applications. In this study, micron-Ag and nano-Ag paste were sintered in either air or nitrogen (N2) atmosphere. While sintered silver joi
Publikováno v:
Tropical biomedicine. 34(1)
Surveys are conducted at central zone of Shah Alam in determining the distribution of dengue vector mosquito population. A minimum of 100 houses was randomly searched for breeding at every 24 localities in central zone of Shah Alam. Number of buildin
Autor:
Kim Shyong Siow, S. T. Chua
Publikováno v:
Journal of Alloys and Compounds. 687:486-498
Sintered Ag joint is a potential Pb-free die attach materials for power electronics because of its high operating temperature, high electrical and thermal conductivity as well as its thermo-mechanical reliability. While the long term reliability of t
Publikováno v:
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging ISBN: 9783319992556
This chapter reviews the main process steps and equipment in producing sintered Ag joints as die attach joint, associated process control, and related tools to enable this control and reliability tests. The primary process steps of sintered Ag joints
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ae56ad4a908bdcf7df17906be30241b
https://doi.org/10.1007/978-3-319-99256-3_3
https://doi.org/10.1007/978-3-319-99256-3_3
Publikováno v:
Journal of Structural Geology. 46:167-185
High-quality three-dimensional (3D) seismic reflection and borehole data from the Egersund Basin, offshore Norway are used to characterise the structural style and determine the timing of growth of inversion-related anticlines adjacent to a segmented
Publikováno v:
36th International Electronics Manufacturing Technology Conference.
Sintered silver is a possible replacement for high performance and Pb free die attach materials in power modules and traditional microelectronic packages because of its high melting temperature, high thermal conductivity and good thermo-mechanical pr